The practical applicability
of ultrathin films, which offer interesting
and novel functionalities, is often hampered by difficulties in large-area
deposition while maintaining homogeneous film properties. Here, we
induce a breakup after forced wetting to produce the ultrathin film
[RundeS.
Runde, S.
1800323Adv. Mater. Interfaces20185 and apply this deposition method to selected liquid metals and alloys
to produce electrically conductive films at ambient conditions on
wafer-scaled areas. In addition to ultrathin monolayers, vertically
stacked and heterostructured multilayers of metal and metal hydroxide
can be built by repeating the deposition method. Structural analysis
using X-ray reflectometry shows that the multilayer thickness is proportional
to the number of deposition cycles, yielding a single layer thickness
between 2.9 and 5.2 nm, depending on the material used. Every single
layer consists of a complex heterostructure composed of a nanometer-thin
metallic core surrounded by stabilizing metal (hydr)oxide skin layers.
The crystallinity of the layers within the films was investigated
with grazing incidence X-ray diffraction; X-ray amorphous materials
were Ga, GaIn(1:1), and GaInSn(7:2:1), which also showed low optical
absorbance and low electrical resistivity. Films made from InSn(1:1)-
and Bi-containing alloys showed weak diffraction peaks, indicating
partial crystallization. The electrical conductivity of all multilayers
increases with the number of deposition cycles, allowing to fine-tune
the sheet resistance. The preparation of ultrathin multilayers of
metallic materials at the centimeter scale is attributed to the low
melting temperature combined with the high surface tension and wettability
of the liquid metals.