bio-compatibility, and high resistance to mechanical damage and chemical attack. [1,2] The combination of exceptional intrinsic properties with a high specific surface area and low dimensionality (in the case of SiC membranes) make nanoporous SiC excellent candidates for application in optoelectronic nanodevices. Many studies have reported that nanoporous structures can improve the material's optical, [3] electronic, and oxidation properties. [4,5] Various possible application scenarios for nanoporous structures have been reported in fields like microelectromechanical systems (MEMS), [6] membranes for biomedical applications, [7] chemical sensors, [8] supercapacitors, [9] and photoelectrodes. [10] In recent years, there have been extensive studies on constructing nanostructure SiC, employing robust and efficient techniques with improved controllability. However, the nanostructuring of SiC is very challenging owing to its extremely high chemical inertness and mechanical resistance. Although various fabrication methods have been developed, SiC nanofabrication techniques, which must meet the strict requirements of scalability and efficiency for industrial applications, remain very limited.The nanofabrication techniques for SiC can be broadly classified into two principal approaches, that is, top-down and bottom-up. The most explored bottom-up nanofabrication approach is a direct chemical synthesis for the growth of low-dimension SiC (i.e., 1D or 2D), such as chemical vapor deposition for the growth of SiC nanowires. [11] However, to produce nanostructure SiC from a single crystal wafer, for example, nanoporous SiC, the top-down fabrication approach by nanoscale etching is more effective and robust. Compared with the bottom-up approach, the top-down principle enables a well-ordered nanostructure with high homogeneity. Primary top-down nanofabrication methods include nanolithography using high-energy particles (i.e., photon, ion, electron), [12] dry etching, [13] and wet etching, [14] resulting in high-quality nanostructures for application in electronic devices or MEMS. The semiconductor lithography technique using UV or electron beam is mainly used for high-resolution nanostructure Nanoporous single-crystal silicon carbide (SiC) is widely used in various applications such as protein dialysis, as a catalyst support, and in photoanodes for photoelectrochemical water splitting. However, the fabrication of nano-structured SiC is challenging owing to its extreme chemical and mechanical stability. This study demonstrates a highly-efficient, open-circuit electrolytic plasma-assisted chemical etching (EPACE) method without aggressive fluorine-containing reactants. The EPACE method enables the nano-structuring of SiC via a plasma-enveloped microtool traversing over the target material in an electrolyte bath. Through process design, EPACE readily produces a uniform nanoporous layer on a 4H-SiC wafer in KOH aqueous solution, with adjustable pore diameters in the range 40-130 nm. Plasma diagnosis by optical emission spectrometr...