1976 IEEE Power Electronics Specialists Conference 1976
DOI: 10.1109/pesc.1976.7072923
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Stable hot spots and second breakdown in power transistors

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Cited by 26 publications
(6 citation statements)
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“…The purpose of this paper is to present experimental results of the RBSB behavior of high voltage, fast switcning power transistors obtained using the nondestructive reverse-bias safe operating arfta test circuit developed at the National Bureau of Standards (NHS) (6). Sarller results ha^re previously been reported [7,81. This paper reports results of measurements of the RBSB behavior of n+-P-"--r.+ power transistors an a function of the rave-se-base current, cane temperature, collector load inductance, and peak collector current.…”
Section: Task 3 •mentioning
confidence: 99%
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“…The purpose of this paper is to present experimental results of the RBSB behavior of high voltage, fast switcning power transistors obtained using the nondestructive reverse-bias safe operating arfta test circuit developed at the National Bureau of Standards (NHS) (6). Sarller results ha^re previously been reported [7,81. This paper reports results of measurements of the RBSB behavior of n+-P-"--r.+ power transistors an a function of the rave-se-base current, cane temperature, collector load inductance, and peak collector current.…”
Section: Task 3 •mentioning
confidence: 99%
“…Most of the measurements described have been made using the nondestructive reverse-bias safe-operating-area test system developed previously at NBS (7].…”
Section: Accomplishmentsmentioning
confidence: 99%
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“…where pc is the n--region resistivity. Using charge control equations, it is possible to more accurately compute the total voltage drop (Hower 1973(Hower , 1976 for devices with narrow emitter stripes.…”
Section: On-state Voltage Drop Of Bipolar Transistorsmentioning
confidence: 99%
“…The so-called "hot spot" is a phenomenon occurring in power transistors with a cellular structure, bipolar [1,2] and also MOS [3] working in high conduction regimes. It consists of a particular situation in which, due to the interaction among geometrical, electrical and thermal factors, a small part of the device accumulates most of the total current.…”
Section: Introductionmentioning
confidence: 99%