2022
DOI: 10.1007/s00339-022-05726-3
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Stable stoichiometric copper nitride thin films via reactive sputtering

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Cited by 9 publications
(8 citation statements)
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“…As observed, the deposition rate varied depending on the deposition conditions used, obtaining similar values to those reported by other authors [32,36]. These data reveal that the working pressure is essential in thin film fabrication.…”
Section: Resultssupporting
confidence: 89%
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“…As observed, the deposition rate varied depending on the deposition conditions used, obtaining similar values to those reported by other authors [32,36]. These data reveal that the working pressure is essential in thin film fabrication.…”
Section: Resultssupporting
confidence: 89%
“…In addition, this would indicate that, under such values of N 2 gas pressure, the target "poisoning" effect would not have started yet; hence, a gradual decrease in the deposition rate with the gas pressure was achieved. As observed, the deposition rate varied depending on the deposition conditions used, obtaining similar values to those reported by other authors [32,36]. These data reveal that the working pressure is essential in thin film fabrication.…”
Section: Resultssupporting
confidence: 89%
See 2 more Smart Citations
“…Chemical composition was qualitatively determined from EDS data, as summarized in Table 4 . These data revealed a qualitative ratio of Cu to N lower than 3, confirming the non-stoichiometry of the fabricated material [ 48 , 49 ]. From these measurements, the samples showed a slight increase in the Cu/N ratio as the RF increased due to the increase in the amount of Cu atoms; but no significant increase of N in the network was observed with rising gas pressure, as we argued when determining the deposition rate.…”
Section: Resultssupporting
confidence: 54%