Stacked flexible parylene-based 3D inductors with Ni&lt;inf&gt;80&lt;/inf&gt;Fe&lt;inf&gt;20&lt;/inf&gt; core for wireless power transmission system

Sun, Xuming; Yang, Zheng; Li, Zhongliang; Li, Xiuhan; Zhang, Haixia

doi:10.1109/memsys.2013.6474376

Cited by 7 publications

(10 citation statements)

References 9 publications

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“…Therefore, the fabricated device has a tolerance to misalignment between the implanted and outer devices in terms of WPT efficiency loss. Table 1 shows the comparison results of the WPT devices [ 37 , 38 ]. Although the method by radio waves has a lower power efficiency compared to electromagnetic induction, it has the advantages of long distance WPT, and it also allows for some misalignment between the implanted and outer devices.…”

Section: Measured Results and Discussionmentioning

confidence: 99%

Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

Okabe

Jeewan

Yamagiwa

et al. 2015

Sensors

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In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction.

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Section: Measured Results and Discussionmentioning

confidence: 99%

Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

Okabe

Jeewan

Yamagiwa

et al. 2015

Sensors

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show abstract

“…Page number 4 JMR- Salerno transmission [15][16][17], tactile sensors [18] and medical imaging [19]. For actuation purposes, millimeter or sub-millimeter scale motion has been obtained by exploiting, in many cases, the simple axial repulsion of a planar coil and an axially magnetized cylindrical magnet [20][21][22][23][24].…”

Section: Researchers Demonstrated the Potential Of This Novel Manufacmentioning

confidence: 99%

A Low Profile Electromagnetic Actuator Design and Model for an Origami Parallel Platform

Salerno

Firouzeh

Paik

2017

Journal of Mechanisms and Robotics

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Thin foldable origami mechanisms allow reconfiguration of complex structures with large volumetric change, versatility, and at low cost; however, there is rarely a systematic way to make them autonomously actuated due to the lack of low profile actuators. Actuation should satisfy the design requirements of wide actuation range, high actuation speed, and backdrivability. This paper presents a novel approach toward fast and controllable folding mechanisms by embedding an electromagnetic actuation system into a nominally flat platform. The design, fabrication, and modeling of the electromagnetic actuation system are reported, and a 1.7 mm-thick single-degree-of-freedom (DoF) foldable parallel structure reaching an elevation of 13 mm is used as a proof of concept for the proposed methodology. We also report on the extensive test results that validate the mechanical model in terms of the loaded and unloaded speed, the blocked force, and the range of actuation.

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“…The magnetic field generation requires an electrical current flow, which has a dramatic impact on the power dissipation and thermal budget characteristics of the manufactured components. Self-heating of the windings poses a reliability issue as the metal tends to expand while embedded in the insulating matrix, e.g., SU-8 [122][123][124] or Parylene [125][126][127]. This can potentially force an uncontrolled stress load on the device.…”

Section: Excitation Sourcesmentioning

confidence: 99%

Integrated Magnetic MEMS Relays: Status of the Technology

2014

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Abstract:The development and application of magnetic technologies employing microfabricated magnetic structures for the production of switching components has generated enormous interest in the scientific and industrial communities over the last decade. Magnetic actuation offers many benefits when compared to other schemes for microelectromechanical systems (MEMS), including the generation of forces that have higher magnitude and longer range. Magnetic actuation can be achieved using different excitation sources, which create challenges related to the integration with other technologies, such as CMOS (Complementary Metal Oxide Semiconductor), and the requirement to reduce power consumption. Novel designs and technologies are therefore sought to enable the use of magnetic switching architectures in integrated MEMS devices, without incurring excessive energy consumption. This article reviews the status of magnetic MEMS technology and presents devices recently developed by various research groups, with key focuses on integrability and effective power management, in addition to the ability to integrate the technology with other microelectronic fabrication processes.

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Stacked flexible parylene-based 3D inductors with Ni<inf>80</inf>Fe<inf>20</inf> core for wireless power transmission system

Cited by 7 publications

References 9 publications

Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

A Low Profile Electromagnetic Actuator Design and Model for an Origami Parallel Platform

Integrated Magnetic MEMS Relays: Status of the Technology

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