2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) 2017
DOI: 10.1109/edaps.2017.8277007
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Stacked patch array in LTCC for 28 GHz antenna-in-package applications

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Cited by 24 publications
(6 citation statements)
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“…The most common solution found in the state-of-the-art to overcome the bandwidth limitations of the patch antenna is the usage of a stacked patch topology [4,5], as seen in Figure 2. However, such technique usually leads to higher order modes which will degrade radiation pattern stability throughout the band of operation [3].…”
Section: Rotationally Symmetric Patch With Parasiticsmentioning
confidence: 99%
See 1 more Smart Citation
“…The most common solution found in the state-of-the-art to overcome the bandwidth limitations of the patch antenna is the usage of a stacked patch topology [4,5], as seen in Figure 2. However, such technique usually leads to higher order modes which will degrade radiation pattern stability throughout the band of operation [3].…”
Section: Rotationally Symmetric Patch With Parasiticsmentioning
confidence: 99%
“…The authors of [4] presented an antenna-in-package solution based on LTCC for 28 GHz. A stacked patch topology was used with a stripline-based feeding network that allowed a wide impedance bandwidth of approximately 3.5 GHz to be obtained.…”
Section: Introductionmentioning
confidence: 99%
“…In [4][5], the metal hole array is used as a wavefront conversion device to enhance the gain. Other techniques to improve the gain are by using the stacked patch configurations [6], increasing resonant frequency of the firstorder mode without changing the size of the patch antenna [7][8], or aperture coupling feed [9]. However, these solutions led to the use of multilayer substrate, resulting in increased complexity and high fabrication cost.…”
Section: Introductionmentioning
confidence: 99%
“…The performance improves by embedding the antenna in the package, which reduces the overall interconnect loss [1]. The cost, however, depends on the chosen substrate technology, which can be printed circuit board (PCB) [2], [4]- [6], low-temperature co-fired ceramic (LTCC) substrate [7], glass substrate [8] or organic built-up substrate [1], [9]. Generally, the most cost-efficient approach is to use conventional PCB technology, especially if a small number of dielectric layers are used.…”
Section: Introductionmentioning
confidence: 99%