Stainless steel to aluminium joining by interfacial doping with Al2O3 powder in wire arc direct energy deposition process

Paul, Amrit Raj; Mishra, Avinash; Mukherjee, Manidipto; Singh, Dilpreet

doi:10.1016/j.matlet.2022.133349

Cited by 4 publications

(4 citation statements)

References 8 publications

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“…Nonetheless, a minor phase shift was observed with Al (111), possibly resulting from the creation of distinct Al–Cu IMCs at high concentrations. Previous studies by Raj Paul et al (2023) have reported similar phenomena of IMC-driven phase shifting.…”

Section: Resultssupporting

confidence: 74%

“…The deposition parameters used while deposition of different section of wall, is shown in Table 2. The deposition parameters for the various materials used in the development of transitional walls were chosen based on previously optimised results (Baby and Amirthalingam, 2020; Paul et al , 2022a; Raj Paul et al , 2023). By using established process variables such as deposition parameters, interlayer thickness and shielding gas flow rates from published literature, the need for multiple wall depositions was eliminated.…”

Section: Materials and Methodologymentioning

confidence: 99%

“…The X-ray diffraction (XRD) technique were used to analyse the different phases formed at the interfaces of as-deposited wall. The dissimilar interfaces are found to be very critical due to formation of IMCs and unpredictable metallurgical and mechanical behaviour (Chen et al , 2020; Dharmendra et al , 2020; Mishra et al , 2022; Raj Paul et al , 2023; Senthil et al , 2021). Therefore, during all the metallurgical and mechanical analysis, the area of interest was abridged to the dissimilar interfaces, i.e.…”

Section: Materials and Methodologymentioning

confidence: 99%

“…Source: Data courtesy of Cheng et al (2020) and Paul et al (2022a) Table 2Source: Data courtesy of Baby and Amirthalingam (2020),Paul et al (2022a) and RajPaul et al (2023) …”

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confidence: 99%

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Influence of copper interlayer on the interface characteristics of stainless steel–aluminium transitional structure in wire arc directed energy deposition

Paul,

Mukherjee,

Sahu

2023

RPJ

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Purpose The purpose of this study is to investigate the deposition of SS–Al transitional wall using the wire arc directed energy deposition (WA-DED) process with a Cu interlayer. This study also aims to analyse the metallographic properties of the SS–Cu and Al–Cu interfaces and their mechanical properties. Design/methodology/approach The study used transitional deposition of SS–Al material over each other by incorporating Cu as interlayer between the two. The scanning electron microscope analysis, energy dispersive X-ray analysis, X-ray diffractometer analysis, tensile testing and micro-hardness measurement were performed to investigate the interface characteristics and mechanical properties of the SS–Al transitional wall. Findings The study discovered that the WA-DED process with a Cu interlayer worked well for the deposition of SS–Al transitional walls. The formation of solid solutions of Fe–Cu and Fe–Si was observed at the SS–Cu interface rather than intermetallic compounds (IMCs), according to the metallographic analysis. On the other hand, three different IMCs were formed at the Al–Cu interface, namely, Al–Cu, Al2Cu and Al4Cu9. The study also observed the formation of a lamellar structure of Al and Al2Cu at the hypereutectic phase. The mechanical testing revealed that the Al–Cu interface failed without significant deformation, i.e. < 4.73%, indicating the brittleness of the interface. Originality/value The study identified the formation of HCP–Fe at the SS–Cu interface, which has not been previously reported in additive manufacturing literature. Furthermore, the study observed the formation of a lamellar structure of Al and Al2Cu phase at the hypereutectic phase, which has not been previously reported in SS–Al transitional wall deposition.

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Section: Resultssupporting

confidence: 74%

Section: Materials and Methodologymentioning

confidence: 99%

Section: Materials and Methodologymentioning

confidence: 99%

“…Source: Data courtesy of Cheng et al (2020) and Paul et al (2022a) Table 2Source: Data courtesy of Baby and Amirthalingam (2020),Paul et al (2022a) and RajPaul et al (2023) …”

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confidence: 99%

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