Start-up response improvement for a MEMS inclinometer

Vágner, Martin; Beneš, Petr

doi:10.1109/i2mtc.2015.7151472

Cited by 7 publications

(2 citation statements)

References 8 publications

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“…The packaging adopts an inflatable form to increase gas damping. Therefore, the device has excellent anti-vibration ability and is widely used in automotive and industrial fields [14]. However, the designed accelerometer can only be placed vertically, and only has the detection capability in the horizontal direction.…”

Section: Introductionmentioning

confidence: 99%

A novel multi-axis pendulum sandwich structure accelerometer

Wei

Han

et al. 2023

J. Micromech. Microeng.

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This paper proposes a new scheme of pendulum accelerometer with sandwich structure. In this scheme, the electrical signal on the mass is connected to the wafer surface through glass isolated Through-Silicon-Via (TSV), so that the basic characteristics of the accelerometer can be obtained by wafer-level testing. Compared with the current commercial device process scheme, the packaging and testing cost of the device can be greatly reduced. The Glass-in-Silicon (GIS) encapsulation caps on both sides of the device are prepared by glass isolated TSV and GIS reflow process. By designing the shape and size of the silicon electrode area and glass area of the GIS caps, the parasitic capacitance between the pendulum structure and the fixed electrode is reduced. Another advantage of using TSV to extract the electrical signal of the mass is that the Z-axis inertial force can be detected when the pendulum structure is placed perpendicular to the direction of gravity acceleration. In addition, electrodes are grown on the side of the split device, and when the pendulum structure is placed parallel to the direction of gravity acceleration, the inertial force of the XY-axis can be detected. The test shows that when the range of the pendulum accelerometer based on this scheme is ±2 g, the noise density of the accelerometer is 42 μg/√Hz (X-axis), 40 μg/√Hz (Y-axis) and 27 μg/√Hz (Z-axis), and the Bias instability (BI) is 6.6 μg (X-axis), 7.1 μg (Y-axis) and 6.8 μg (Z-axis), reaching the level of commercial devices.

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Section: Introductionmentioning

confidence: 99%

A novel multi-axis pendulum sandwich structure accelerometer

Wei

Han

et al. 2023

J. Micromech. Microeng.

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“…The devices of Colibris are based on three-layer silicon bonding and have excellent temperature stability [ 3 ], but the preparation cost is high, and it is often used in high-performance fields such as aerospace engineering [ 4 ]. The devices from Murata use a silicon glass composite cover plate as the upper and lower electrodes, and the electrodes are grown on the sidewalls through a hard mask, which achieves a good balance between performance and cost, and has a wide range of applications in the automotive and industrial fields [ 5 ]. However, since Murata’s structure requires electrodes to be grown on the sidewalls, it is not possible to screen the yield of devices on the wafer [ 6 ], and the cost is still higher than that of consumer-grade accelerometers.…”

Section: Introductionmentioning

confidence: 99%

A High-Performance MEMS Accelerometer with an Improved TGV Process of Low Cost

Han

et al. 2022

Micromachines

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High-performance MEMS accelerometers usually use a pendulum structure with a larger mass. Although the performance of the device is guaranteed, the manufacturing cost is high. This paper proposes a method of fabricating high-performance MEMS accelerometers with a TGV process, which can reduce the manufacturing cost and ensure the low-noise characteristics of the device. The TGV processing relies on laser drilling, the metal filling in the hole is based on the casting mold and CMP, and the packaging adopts the three-layer anodic bonding process. Moreover, for the first time, the casting mold process is introduced to the preparation of MEMS devices. In terms of structural design, the stopper uses distributed comb electrodes for overload displacement suppression, and the gas released by the packaging method provides excellent mechanical damping characteristics. The prepared accelerometer has an anti-overload capability of 10,000 g, the noise density is less than 0.001°/√Hz, and it has ultra-high performance in tilt measurement.

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An Effective Method on Vibration Immunity for Inclinometer based on MEMS Accelerometer

Hoang

Pietrosanto

2020

2020 International Semiconductor Conference (CAS)

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Start-up response improvement for a MEMS inclinometer

Cited by 7 publications

References 8 publications

A novel multi-axis pendulum sandwich structure accelerometer

A novel multi-axis pendulum sandwich structure accelerometer

A High-Performance MEMS Accelerometer with an Improved TGV Process of Low Cost

An Effective Method on Vibration Immunity for Inclinometer based on MEMS Accelerometer

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