2007 Proceedings 57th Electronic Components and Technology Conference 2007
DOI: 10.1109/ectc.2007.373942
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Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock Loads

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Cited by 69 publications
(5 citation statements)
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“…3. Vibration combined with other downhole factors such as temperature, shock, and resonance have a damaging impact on drilling tool failure and lifetime [4,21,47,[66][67][68]. Table 2 lists research efforts on applying vibration factor in reliability modeling and predictions based on FRBD by statistical modeling, Bayesian method, data mining, Monte Carlo simulation, advanced computing, and analytics methods [17,69,70].…”
Section: Drill String Modeling Optimization Systemmentioning
confidence: 99%
“…3. Vibration combined with other downhole factors such as temperature, shock, and resonance have a damaging impact on drilling tool failure and lifetime [4,21,47,[66][67][68]. Table 2 lists research efforts on applying vibration factor in reliability modeling and predictions based on FRBD by statistical modeling, Bayesian method, data mining, Monte Carlo simulation, advanced computing, and analytics methods [17,69,70].…”
Section: Drill String Modeling Optimization Systemmentioning
confidence: 99%
“…Drilling electronics operate in extremely harsh downhole environments with temperatures exceeding 150C, shock and vibration levels exceeding 15g. The impact of temperature, shock and vibration on the life of electronics is described by Barker et al (1992), Duffek (2004), Garvey et al (2009), Gingerich et al (1999), Lall et al (2005Lall et al ( , 2007, Mirgkizoudi et al (2010), Pecht et al (1999), Vichare (2006), Vijayaragavan (2003), Wassell & Stroehlein (2010), White & Bernstein (2008). Other factors like power cycles, thermal ramp rates, electrical overstress, mechanical stress and manufacturing defects impact reliability of tools, but the factors cannot be accurately measured in downhole drilling environments and encompass high uncertainty.…”
Section: Introductionmentioning
confidence: 99%
“…Material modeling to predict degradation of solder joints in the circuit board as results of thermo mechanical fatigue was developed by Nasser & Curtin (2006). Lall et al (2007) used experimental tests in combination with finite element analysis to model solder joint failure from shock and vibration. Mirgkizoudi et al (2010) developed a test plan to evaluate the reliability and service life of electronic components that are subject to a combination of mechanical, thermal, chemical or electrical inputs, and Wassell & Stroehlein (2010) use accelerated tests to derive accumulated damage models and failure thresholds as functions of vibration, shock levels, the number of shocks and the operating temperature.…”
Section: Introductionmentioning
confidence: 99%
“…These factors also support for comprehensive condition-based and reliability-centered maintenance. Prior to the introduction of a first SJ BIST TM sensor, there were no known methods available for detecting faults in solder-joint networks belonging to fully-programmed FPGAs, particularly FPGAs in Ball Grid Array (BGA) packages, such as XILINX® FG1156 [1][2][3][4][5][6].…”
Section: Introductionmentioning
confidence: 99%