Status and Trend of Power Semiconductor Module Packaging for Electric Vehicles

Wang, Yangang; Dai, Xiaoping; Liu, Guoyou; Wu, Yibo; Li, Yun; Jones, Steve

doi:10.5772/64173

Cited by 10 publications

(4 citation statements)

References 11 publications

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“…Moreover, sudden acceleration and deceleration lead to significant power cycling. VOLUME 10, 2022 To address these issues, advanced cooling techniques for EV converters have been presented in [41], [48] and [269].…”

Section: Impact Of Harsh Environment On Pec Thermal Managementmentioning

confidence: 99%

Emerging Trends and Challenges in Thermal Management of Power Electronic Converters: A State of the Art Review

Rahman,

Moghassemi,

Arsalan

et al. 2024

IEEE Access

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Recently, the thermal management of power electronic converters has gained significant attention due to the continuous trend of developing very compact power electronic converters with high power density. With the evolution of power semiconductor devices, high operating temperatures and large thermal cycles have become possible, necessitating a significant improvement in thermal system designs. Researchers have made significant efforts to develop effective thermal management systems for improving the reliability and lifetime of power electronic converters. This article intends to present a thorough review of thermal management systems employed in power electronics cooling. The applied thermal management techniques have been reviewed from the perspective of electrical parameter regulation and heat dissipation control. Regulation of electrical parameters involves active thermal control, which is a method for controlling junction temperature and thermal cycling of power semiconductor devices. The active thermal control implementation processes reviewed in this article consist of increasing overload capacity, manipulating switching and conduction losses, employing modified modulation process, balancing thermal stress at the converter level, and controlling thermal stress at the system level. Control of heat dissipation can be achieved through direct and indirect cooling of power electronic converters with air or liquid as the coolant. The effectiveness and implementation methods of these cooling techniques, such as channel cooling, phase change material-based cooling, immersion cooling, jet impingement and spray cooling, are reviewed in this paper. Moreover, performance-enhancing ideas and challenges for these techniques are discussed. The primary objective of this review paper is to bridge the existing gap in the literature by offering a comprehensive comparison of commonly employed thermal management techniques. INDEX TERMSActive thermal control (ATC), Power semiconductor device (PSD), Microchannel, Spray cooling, Jet impingement, Immersion cooling, Phase change material (PCM), and Active cooling.

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Section: Impact Of Harsh Environment On Pec Thermal Managementmentioning

confidence: 99%

Emerging Trends and Challenges in Thermal Management of Power Electronic Converters: A State of the Art Review

Rahman,

Moghassemi,

Arsalan

et al. 2024

IEEE Access

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“…The demands for increasing power density and reducing cost bring a great challenge for the onboard cooling system. Besides, the ambient temperature under the hood could be as high as 100 • C with high humidity [77]. Furthermore, the frequent acceleration/deceleration of the vehicle could lead to large power cycling and surging, which will further challenge the cooling system.…”

Section: Cooling Assemblies and Conceptsmentioning

confidence: 99%

“…The charging profile shown in Fig. 8(b) is used to calculate the capacitor's electrical and thermal loading [77], [86]. The resulting core-to-ambient temperature profile is then used to determine the capacitor's reliability metrics, under the given mission profiles.…”

Section: And 5 Respectivelymentioning

confidence: 99%

Reliability of Power Electronic Systems for EV/HEV Applications

et al. 2021

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The electrification of the transportation sector is moving on at a fast pace. All car manufacturers have strong programs to electrify their car fleet to fulfill the demands of society and customers by offering carbon-neutral technologies to bring goods and persons from one location to another. Power electronics technology is, in this evolution, essential and also in a rapid development technology-wise. Some of the introduced technologies are quite mature, and the systems designed must have high reliability as they can be quite complicated from an electrical perspective. Therefore, this article focuses on the reliability of the used power electronic systems applied in electric vehicles (EVs) and hybrid EVs (HEVs). It introduces the reliability requirements and challenges given for the power electronics applied in EV/HEV applications. Then, the advances in power electronic components to address the reliability challenges are introduced as they individually contribute to the overall system reliability. The reliability-oriented design methodology is also discussed, including two examples: an EV onboard charger and the drive train inverter. Finally, an outlook in terms of research opportunities in power electronics reliability related to EV/HEVs is provided. It can be concluded that many topics are already well handled in terms of reliability, but issues related to complete new technology introduction are important to keep the focus on.

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“…They play a major role in powertrain electrification. 1,2 Traction inverters, in which power semiconductor modules represent core elements, 3,4 drive motor speed and torque by regulating the energy exchange between battery and electric motor. Considering the stringent requirements of the automotive market, mechanical integration, reliability, and efficiency represent key aspects of power module development.…”

Section: Introductionmentioning

confidence: 99%

Warpage modeling for semiconductor power module manufacturing flow improvement

Calabretta

Sitta

Rundo

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part B:

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The hybrid and battery electric vehicle market is heavily increasing the demand for semiconductor power modules. The manufacturing of such products is more complex than discrete devices. Some parameters, such as module deformation (warpage), play a major role. Power modules have to comply with customer Geometric Dimensioning & Tolerancing (GD&T) targets in order to avoid coolant leakage during operation and to guarantee mechanical compatibility with the driving board. Compliance with an appropriate flatness tolerance reduces rejects during manufacturing processes such as ultrasonic welding, and the consequent impact on reliability. Due to these requirements, there is a need to implement dedicated countermeasures during manufacturing flows and to develop the proper methodologies to monitor flatness tolerances. Appropriate component selection at the design stage also limits flatness through the prediction of deformations during assembly flows using finite element model. This activity outlines the manufacturing flow for a direct cooled semiconductor power module and presents a method for product optimization in terms of flatness tolerance using a dedicated finite element model that calculates the warpage deformation induced by baseplate soldering and different ceramic substrate layouts. Furthermore, we describe experimental methodologies for measuring power module flatness and straightness across the manufacturing phases. Dedicated experiments were conducted for methodological and design validation.

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Status and Trend of Power Semiconductor Module Packaging for Electric Vehicles

Cited by 10 publications

References 11 publications

Emerging Trends and Challenges in Thermal Management of Power Electronic Converters: A State of the Art Review

Emerging Trends and Challenges in Thermal Management of Power Electronic Converters: A State of the Art Review

Reliability of Power Electronic Systems for EV/HEV Applications

Warpage modeling for semiconductor power module manufacturing flow improvement

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