Steady state experimental investigation of thermal contact conductance between curvilinear contacts using liquid crystal thermography

Kumar, Surya; Tariq, Andallib

doi:10.1016/j.ijthermalsci.2017.04.014

Cited by 27 publications

(7 citation statements)

References 27 publications

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“…This investigation is a computational study, so all of the experimental data used in this study were extracted from literature [1,[9][10][11]. Extracted data contains 287 total experimental data that belong to various roughness parameters, position and time which results in different temperatures.…”

Section: Data Collectionmentioning

confidence: 99%

“…The most important parameters affecting the heat transfer across the interface are contact loading, surface roughness, thermophysical and mechanical properties. When two solid bodies are in touch, their physical contacts are limited to the finite number of separated points at their interface [1]. The real contact area is in microscopic scale which is relatively very small compared to the apparent contact area.…”

Section: Introductionmentioning

confidence: 99%

“…The relatively high temperature difference occurs between the interfaces, because after heat flows through the macro contact, it must pass through the micro-contacts to conduct from one surface to another [2]. A constriction at the contact surface in the heat transfer is created by this phenomenon named as thermal contact resistance (TCR) defined as follows [1,2]. …”

Section: Introductionmentioning

confidence: 99%

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Mathematical modeling of thermal contact resistance for different curvature contacting geometry using robust approach

Shojaeefard

Aghvami

2018

Scientia Iranica

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Section: Data Collectionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Mathematical modeling of thermal contact resistance for different curvature contacting geometry using robust approach

Shojaeefard

Aghvami

2018

Scientia Iranica

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“…Recently, Rahmani et al [5] showed the analytical results on the thermal spreading resistance of a curved-edge heat spreader. Moreover, Kumar and Tariq [6] showed the experimental results on the constriction/spreading heat transfer characteristics between curvilinear contacts of rods. Up to now, many studies have been conducted on the constriction/spreading resistances.…”

Section: Introductionmentioning

confidence: 99%

Numerical Study on Heat Transfer Characteristics of Heated/Cooled Rods Having a Composite Board in between: Effect of Thermal Vias

Koito¹,

Tomimura²

2017

JECTC

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By placing a sample between a heated and a cooled rod, a thermal conductivity of the sample can be evaluated easily with the assumption of a one-dimensional heat flow. However, a three-dimensional constriction/spreading heat flow may occur inside the rods when the sample is a composite having different thermal conductivities. In order to investigate the thermal resistance due to the constriction/spreading heat flow, the three-dimensional numerical analyses were conducted on the heat transfer characteristics of the rods. In the present analyses, a polymer-based composite board having thermal vias was sandwiched between the rods. From the numerical results, it was confirmed that the constriction/spreading resistance of the rods was strongly affected by the thermal conductivity of the rods as well as the number and size of the thermal vias. A simple equation was also proposed to evaluate the constriction/spreading resistance of the rods. Fairly good agreements were obtained between the numerical results and the calculated ones by the simple equation. Moreover, the discussion was also made on an effective thermal conductivity of the composite board evaluated with the heated and the cooled rod.

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“…49 Steady-state and transient methods are the two methods used to estimate TCC. 20 The literature pertaining to the heat transfer across the interfaces is abundant with results that are conducted under steady-state conditions. 50 However, not much efforts have been made to understand the combined effect of load, thermophysical properties of the source, sink materials and TIMs on the interfacial heat transfer across the interface under transient conditions.…”

mentioning

confidence: 99%

Thermal conformance parameters for assessment of heat transfer between similar and dissimilar metal contacts

Pathumudy,

Samuel,

Prabhu

2024

Heat Trans

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A novel approach to assess the thermal conformance between two metallic materials under transient conditions was proposed in the present investigation. Thermal conformance parameters (ƞ, ϴ, tg) were defined to quantify the contact condition between a metal–metal interface. To assess the effect of load and thermophysical properties of the sink and source materials on the degree of thermal conformance, a thermal conformance assessment parameter (TCAP) was proposed. Heat flux transients at the thermal interface was estimated by using an inverse heat conduction approach for various similar and dissimilar metallic surfaces in contact such as Cu─Cu, Al─Al, Al─Cu, and Cu─Al under both load and no load conditions. Commercially available silicone grease (SG) and thermal grease (CTG) were used as thermal interface materials (TIMs). The thermal conformance parameters increased with the increase in load for all the combinations of interfaces with and without TIMs. It was observed that, except for the copper–copper combination, thermal conformance parameters showed a linear relation with the TCAP. The enhancement in the heat transfer due to the application of load and TIM was validated by determining the maximum temperature difference (∆Tmax) across the interface. The experimental study revealed that the ∆Tmax decreases with the application of load and application of TIM leading to enhanced heat transfer. For the copper–copper combination, the thermal conformance depended solely on the load applied. Due to the lower thermal resistance offered by copper source/sink materials, the interfacial resistance between them becomes a dominant factor. The effect of TIM on heat absorbed by the sink was significant for the Cu/Cu interface.

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Steady state experimental investigation of thermal contact conductance between curvilinear contacts using liquid crystal thermography

Cited by 27 publications

References 27 publications

Mathematical modeling of thermal contact resistance for different curvature contacting geometry using robust approach

Mathematical modeling of thermal contact resistance for different curvature contacting geometry using robust approach

Numerical Study on Heat Transfer Characteristics of Heated/Cooled Rods Having a Composite Board in between: Effect of Thermal Vias

Thermal conformance parameters for assessment of heat transfer between similar and dissimilar metal contacts

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