Steady-state propagation of interface corner crack

Veluri, Badrinath; Jensen, Henrik Myhre

doi:10.1016/j.ijsolstr.2013.01.022

Cited by 16 publications

(6 citation statements)

References 17 publications

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“…The indentation-induced delamination modelling of non-isotropic (or orthotropic) bi-materials is a complex problem [56] because it includes many material constants which make the numerical solution for interior edge delamination more complex and difficult to present in a compact form. Not much models exist addressing edge delamination problem for orthotropic materials.…”

Section: Indentation -Induced Interior Edge Delaminationmentioning

confidence: 99%

“…Not much models exist addressing edge delamination problem for orthotropic materials. An example of one such model is [56] which analysed the interior edge crack in an orthotropic bi layer strip. Later, the influences of delaminations evolving at the edge/corner of film-substrate system considering orthotropic bi layer strip was analysed in [57,58] however, these models were limited to homogeneous layers.…”

Section: Indentation -Induced Interior Edge Delaminationmentioning

confidence: 99%

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A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

Nazir

Khan

2017

Engineering Failure Analysis

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This paper contains a review of the most vital concepts regarding the analysis and design of film systems. Various techniques have been presented to analyse and predict the failure of films for all common types of failure: fracture, delamination, general yield, cathodic blistering, erosive and corrosive wear in both organic and inorganic films. Interfacial fracture or delamination is the loss of bonding strength of film from substrate, and is normally analysed based on the fracture mechanics concepts of bi-material systems. Therefore, keeping the focus of this review on bonding strength, the emphasis will be on the interfacial cracking of films and the corresponding stresses responsible for driving the delamination process. The bi-material characteristics of film systems make the nature of interfacial cracks as mixed mode, with cracks exhibiting various complex patterns such as telephone cord blisters. Such interfacial fracture phenomenon has been widely studied by using fracture mechanics based applicable analysis to model and predict the fracture strength of interface in film systems. The incorporation of interfacial fracture mechanics concepts with the thermodynamics/diffusion concepts further leads to the development of corrosive degradation theories of film systems such as cathodic blistering. This review presents the suggestions for improvements in existing analysis techniques to overcome some of the limitations in film failure modelling. This comprehensive review will help researchers, scientists, and academics to understand, develop and improve the existing models and methods of film-substrate systems.

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Section: Indentation -Induced Interior Edge Delaminationmentioning

confidence: 99%

Section: Indentation -Induced Interior Edge Delaminationmentioning

confidence: 99%

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

Nazir

Khan

2017

Engineering Failure Analysis

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“…The of Problem 2 with a stress field in the cracked body due to normal stress nn σ and tangential stress nt σ at the edge of the film was solved by the finite element method assuming plane stress conditions. For any given initial shape of the crack front, a given stress level and a given interface fracture criterion the stresses nn σ and nt σ are calculated [6]. In general Eq.…”

Section: Modeling the Crack Tip Profile For Steady-state Delamination...mentioning

confidence: 99%

Modeling Delamination of Interfacial Corner Cracks in Multilayered Structures

Veluri

Jensen

2012

KEM

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Multilayered electronic components, typically of heterogeneous materials, delaminate under thermal and mechanical loading. A phenomenological model focused on modeling the shape of such interface cracks close to corners in layered interconnect structures for calculating the critical stress for steady-state propagation has been developed. The crack propagation is investigated by estimating the fracture mechanics parameters that include the strain energy release rate, crack front profiles and the three-dimensional mode-mixity along the crack front. The developed numerical approach for the calculation of fracture mechanical properties has been validated with three-dimensional models for varying crack front shapes. A custom quantitative approach was formulated based on the finite element method with iterative adjustment of the crack front to estimate the critical delamination stress as a function of the fracture criterion and corner angles.

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“…In a different way of inquiry, Veluri and Jensen (2013) directed their focus towards modeling the shape of the interface crack front and determining the critical stress for steady-state crack propagation, involving a rigorous estimation of the strain energy release rate, crack front profiles, and 3D mode mixity along the interface crack front. Their results contributed to a deeper understanding of the aspects of crack propagation at interfaces under specific stress conditions, aiding in the assessment of crack stability and growth in bonded materials [25]. Langlois et al (2015) have proposed a method to derive the SIFs for the 3D cracks with the curved crack front, which is a combination of the direct integration method and the X-FEM (extended finite element method) localized multigrid approach.…”

Section: Introductionmentioning

confidence: 99%

Prediction of the Crack Front Shape of the Corner Interface Crack

Djoković,

Nikolić,

Pastorková

et al. 2023

Applied Sciences

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This study delves into the analysis of interface crack propagation originating from a right-angle corner along the bonding plane between the two plates composed of dissimilar materials. The research explores three distinct crack front shapes: concave, triangular, and convex (quarter-circle). The obtained results, meticulously presented in this paper, offer valuable insights into the nature of the crack propagation along these geometries. The findings elucidate that in the case of a convex crack front, the edges demonstrate a significantly accelerated propagation compared to the rest of the crack front. Conversely, for the triangular and concave crack fronts, the central region experiences faster propagation compared to the edges. These revelations lead to a generalized conclusion regarding the stability of different crack front shapes, highlighting the triangular crack front as the most stable configuration in this context. The implications of these observations provide essential knowledge for understanding and managing crack propagation in composite structures, offering potential applications in various engineering domains.

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Steady-state propagation of interface corner crack

Cited by 16 publications

References 17 publications

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

Modeling Delamination of Interfacial Corner Cracks in Multilayered Structures

Prediction of the Crack Front Shape of the Corner Interface Crack

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