Stencil mask methodology for the parallelized production of microscale mechanical test samples

Abstract

A new methodology to parallelize the production of micromechanical test samples from bulk materials is reported. This methodology has been developed to produce samples with typical gage dimensions on the order of 20-200 μm, and also to minimize the reliance on conventional focused ion beam fabrication methods. The fabrication technique uses standard microelectronic process methods such as photolithography and deep-reactive ion etching to create high aspect ratio patterned templates-stencil masks-from a silicon wafer. In the present work, the stencil mask pattern consists of a linear row of tensile samples, where one grip of each sample is integrally attached to the bulk substrate. Once fabricated, the stencil mask is placed on top of a pre-thinned substrate, and the pattern and substrate are co-sputtered using a broad ion beam milling system, which ultimately results in the transfer of the mask pattern into the substrate. The methodology is demonstrated using a Si stencil mask and a polycrystalline Ni foil to manufacture an array of metallic micro-tensile samples.

Exploration and Development of High Entropy Alloys for Structural Applications

“…Perhaps the most daunting task has been parallel micro-sample preparation. Recently Shade and co-workers have demonstrated a stencil mask method for the parallel production of micro-samples using polycrystalline nickel [73]. Samples were successfully tested using an in-situ tensile stage within a scanning electron microscope.…”

Novel Methods for the Site Specific Preparation of Micromechanical Structures

“…Masken) aufgebracht werden (4 b). Hiernach wird erneut, ähnlich den Ausführungen in [26], ionenpoliert (c). Auf diese Weise können anschließend Mikroproben ohne FIB angefertigt werden (Bild 4d).…”

Micromechanical testing of ultrathin layered material specimens at elevated temperature

“…The broad ion beam technique using the stencil mask methodology also enables to thin down a higher volume of material by ion milling, in order to assess the mechanical properties of few-hundred micrometres-long specimens. 7 A competitive solution for producing ultrathin specimens with gauge dimensions in a range between one micrometre and few hundreds of micrometres is the lithographic method. This latter method is commonly used in MEMS and was transposed to ultrathin specimen design.…”