2012
DOI: 10.1109/ted.2012.2206595
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Strain and Temperature Dependence of Defect Formation at AlGaN/GaN High-Electron-Mobility Transistors on a Nanometer Scale

Abstract: Abstract-We use depth-resolved cathodoluminescence spectroscopy (DRCLS), Kelvin probe force microscopy (KPFM), and surface photovoltage spectroscopy (SPS) on a nanometer scale to map the temperature, strain, and defects inside GaN highelectron-mobility transistors. DRCLS maps temperature at localized depths, particularly within the 2-D electron gas region during device operation. KPFM maps surface electric potential across the device, revealing lower potential patches that decrease rapidly with increasing OFF-… Show more

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Cited by 15 publications
(8 citation statements)
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“…Also, DRCLS can probe selectively at 2DEG depths versus deeper into the GaN buffer layer and beyond. Lin et al used DRCLS to measure and map the temperature distribution and defect generation inside state-of-the-art AlGaN/GaN HEMT's on a scale of tens of nanometres [118,119]. Figure 23(a) shows a scaled crosssectional schematic of a gated HEMT structure.…”
Section: Application To Transistorsmentioning
confidence: 99%
“…Also, DRCLS can probe selectively at 2DEG depths versus deeper into the GaN buffer layer and beyond. Lin et al used DRCLS to measure and map the temperature distribution and defect generation inside state-of-the-art AlGaN/GaN HEMT's on a scale of tens of nanometres [118,119]. Figure 23(a) shows a scaled crosssectional schematic of a gated HEMT structure.…”
Section: Application To Transistorsmentioning
confidence: 99%
“…However, under the illumination of a focused beam, the inhomogeneity of the device can be investigated. By raster scanning the laser beam while monitoring the short-circuit current of a PV cell, one can have a so-called laser-beam-induced current (LBIC) map [22] . One can further park the laser beam at one location to measure the light I-V characteristic.…”
Section: Microscopic I-v Measurements Under Illumination At Defect Sitesmentioning
confidence: 99%
“…Specifically, after a device is fabricated, individual defects on the device are identified. Then, the impact of individual defects is thoroughly investigated by applying different techniques as needed in a proper order, such as electroluminescence (EL), PL, micro-Raman, and micro-scale il- luminated current-voltage (I-V) measurements [22] . As the last step, the atomic-scale defect structures for the same defects are determined using HRTEM.…”
Section: Introductionmentioning
confidence: 99%
“…[22] Finally, the atomic-scale defect structure for the same defects are determined using high-resolution TEM. It has been shown previously that defects may be modified or mutate during device operation [23] or under high density photoexcitation. [5] This work investigates defects in their as-grown states by limiting the injection current and illumination light density to below the mutation thresholds, so that the native defect structure can be determined by TEM.…”
Section: Introductionmentioning
confidence: 99%