Strain measurement in micro-electronic packages using the digital image correlation method

Ikeda, Tôru; Kanno, Toshifumi; Shishido, Nobuyuki; Miyazaki, Noriyuki; Tanaka, Hiroyuki; Hatao, Takuya

doi:10.1080/09507116.2011.590654

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Overview and Development Status Of Microelectronics Technology1

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2022

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“…Microelectronic technology has advantages and characteristics that traditional electronic technology does not have: microelectronic technology mainly realizes information processing or information processing through the microscopic electron movement in the solid; Microelectronic signal transmission can be carried out on a very small scale; Microelectronic technology can integrate a subsystem or electronic functional component into the chip, which has higher integration and more comprehensive functionality. [2] Microelectronics can work in lattice-level microregions.…”

Section: Overview and Development Status Of Microelectronics Technologymentioning

confidence: 99%

Research Progress on Key Technologies of Microelectronics for Industry 4.0

Wang¹

2022

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With the continuous improvement of China's science and technology and economic development level, automatic control runs through all walks of life in China, and the Industry 4.0 era dominated by Internet of Things and intelligent manufacturing has gradually matured. Therefore, according to the changing market requirements, automatic control requirements have become higher and higher, and it is more and more common to integrate automatic control technology in the field of microelectronics. With the use of microelectronic technology, electrical control can be carried out more accurately, and the volume of equipment can be reduced, thus serving the future development of automatic control field. This paper analyzes the key technology of microelectronics.

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Section: Overview and Development Status Of Microelectronics Technologymentioning

confidence: 99%

Research Progress on Key Technologies of Microelectronics for Industry 4.0

Wang¹

2022

AJST

View full text Add to dashboard Cite

show abstract

Strain measurement in micro-electronic packages using the digital image correlation method

Cited by 1 publication

References 1 publication

Research Progress on Key Technologies of Microelectronics for Industry 4.0

Research Progress on Key Technologies of Microelectronics for Industry 4.0

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