Strain Rate and Temperature Effects on the Strength and Dissipative Mechanisms in Al-Cu 50 Zr 50 Interface Model: Molecular Dynamics Simulation Study

Gupta, Pradeep; Yedla, Natraj

doi:10.1016/j.proeng.2017.04.128

Cited by 10 publications

(2 citation statements)

References 32 publications

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“…The percentage of ordered atoms gradually decrease with the increase of temperature when the strain rate remain unchanged, as shown in figure 10(e). These conditions indicates that the fracture mechanism is changed due to accelerates the atomic thermal motion [44] with the increase of temperature at the same strain rates.…”

Section: Microscopic Fracture Morphologymentioning

confidence: 85%

Molecular dynamics simulations of tensile mechanical properties and microstructures of Al-4.5Cu alloy: the role of temperature and strain rate

Huang¹,

Wang²,

Dai³

2022

Modelling Simul. Mater. Sci. Eng.

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In this paper, the deformation behavior of Al-4.5Cu alloys containing the Cu clusters under high temperature is systematacially investigated by molecular dynamics. Reduced nucleation stress of dislocation is driven by increasing strain rate and temperature, which triggers the stress-strain curves of Al-4.5Cu alloy showing gradually elastic-plastic stage and elastic-plastic-viscous stage. Besides, the defect surface in Al-4.5Cu alloy don’t have enough time to move along and gather due to the increase of strain rate, which make the distribution of defect surface mainly divide into three types: the plane distribution which is at 45°angle to the direction of tensile, the stratification distribution which is perpendicular to the direction of tensile and the distribution of honeycomb, respectively. The microscopic fracture morphology for Al-4.5Cu alloy are changed from pure shear fracture to microporous aggregate fracture due to three type of defect surface.

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Section: Microscopic Fracture Morphologymentioning

confidence: 85%

Molecular dynamics simulations of tensile mechanical properties and microstructures of Al-4.5Cu alloy: the role of temperature and strain rate

Huang¹,

Wang²,

Dai³

2022

Modelling Simul. Mater. Sci. Eng.

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“…Compared to the tensile tests in [1] and following the Hall-Petch rule [24], our model has the average grain size in the range at which we can expect the highest values of stresses for the chosen strain rates. In the tensile test it is expected the stresses increase with the strain rate [2][3][4]27] and decrease with the temperature [22,27]. In the second part, the influence of a hole in the NC BCC iron during the tensile test is investigated.…”

Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Simulation Study of the Mechanical Properties of Nanocrystalline Body-Centered Cubic Iron

et al. 2020

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In the present work, the mechanical properties of nanocrystalline body-centered cubic (BCC) iron with an average grain size of 10 Å were investigated using molecular dynamics (MD) simulations. The structure has one layer of crystal grains, which means such a model could represent a structure with directional crystallization. A series of uniaxial tensile tests with different strain rates and temperatures was performed until the full rupture of the model. Moreover, tensile tests of the models with a void at the center and shear tests were carried out. In the tensile test simulations, peak stress and average values of flow stress increase with strain rate. However, the strain rate does not affect the elasticity modulus. Due to the presence of void, stress concentrations in structure have been observed, which leads to dislocation pile-up and grain boundary slips at lower strains. Furthermore, the model with the void reaches lower values of peak stresses as well as stress overshoot compared to the no void model. The study results provide a better understanding of the mechanical response of nanocrystalline BCC iron under various loadings.

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The Effect of Strain Rate and Temperature on the Mechanical Behavior of Al/Fe Interface Under Compressive Loading

Chlouk

Shehadeh

Hamade

2020

Metall Mater Trans A

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Strain Rate and Temperature Effects on the Strength and Dissipative Mechanisms in Al-Cu 50 Zr 50 Interface Model: Molecular Dynamics Simulation Study

Cited by 10 publications

References 32 publications

Molecular dynamics simulations of tensile mechanical properties and microstructures of Al-4.5Cu alloy: the role of temperature and strain rate

Molecular dynamics simulations of tensile mechanical properties and microstructures of Al-4.5Cu alloy: the role of temperature and strain rate

Molecular Dynamics Simulation Study of the Mechanical Properties of Nanocrystalline Body-Centered Cubic Iron

The Effect of Strain Rate and Temperature on the Mechanical Behavior of Al/Fe Interface Under Compressive Loading

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