Strap-down microelectromechanical (MEMS) sensors for high-g munition applications

Brown, Thomas G.; Davis, Bradley Moore; Hepner, David J.; Faust, Jonah N.; Myers, Cecil K.; Muller, Chantal; Harkins, Thomas E.; Holis, M.; Placzankis, Brian E.

doi:10.1109/20.911850

Cited by 106 publications

(57 citation statements)

References 4 publications

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“…Béliveau et al [11] characterized experimentally the response of commercial accelerometers due to shock loads and observed some unexpected responses. Brown and Davis [12] and Brown et al [13] subjected commercial accelerometers and a pressure sensor to high-g tests. They reported peculiar modes of failure under severe shock conditions and concluded that improved dynamic modeling and characterization of MEMS devices under shock load are needed.…”

Section: Introductionmentioning

confidence: 99%

Investigation of the response of microstructures under the combined effect of mechanical shock and electrostatic forces

Younis

Miles²,

Jordy³

2006

J. Micromech. Microeng.

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There is strong experimental evidence for the existence of strange modes of failure of microelectromechanical systems (MEMS) devices under mechanical shock and impact. Such failures have not been explained with conventional models of MEMS. These failures are characterized by overlaps between moving microstructures and stationary electrodes, which cause electrical shorts. This work presents modeling and simulation of MEMS devices under the combination of shock loads and electrostatic actuation, which sheds light on the influence of these forces on the pull-in instability. Our results indicate that the reported strange failures can be attributed to early dynamic pull-in instability. The results show that the combination of a shock load and an electrostatic actuation makes the instability threshold much lower than the threshold predicted, considering the effect of shock alone or electrostatic actuation alone. In this work, a single-degree-of-freedom model is utilized to investigate the effect of the shock-electrostatic interaction on the response of MEMS devices. Then, a reduced-order model is used to demonstrate the effect of this interaction on MEMS devices employing cantilever and clamped-clamped microbeams. The results of the reduced-order model are verified by comparing with finite-element predictions. It is shown that the shock-electrostatic interaction can be used to design smart MEMS switches triggered at a predetermined level of shock and acceleration.

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Section: Introductionmentioning

confidence: 99%

Investigation of the response of microstructures under the combined effect of mechanical shock and electrostatic forces

Younis

Miles²,

Jordy³

2006

J. Micromech. Microeng.

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“…The global positioning system (GPS) (1,2), inertial measurement units (3), and seekers (4) often navigate munitions to the target. Course correction may be achieved through aerodynamic (5) or jet (6) control.…”

Section: Introductionmentioning

confidence: 99%

Guidance and Control of a Man-Portable Precision Munition Concept

Fresconi¹,

Rogers²

2014

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Approved for public release; distribution is unlimited.ii REPORT DOCUMENTATION PAGE Form Approved OMB No. 0704-0188Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing the burden, to Department of Defense, Washington Headquarters Services, Directorate for Information Operations and Reports (0704-0188), 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302. Respondents should be aware that notwithstanding any other provision of law, no person shall be subject to any penalty for failing to comply with a collection of information if it does not display a currently valid OMB control number. PLEASE DO NOT RETURN YOUR FORM TO THE ABOVE ADDRESS. REPORT DATE (DD-MM-YYYY)June 2014 ARL-TR-6966 SPONSORING/MONITORING AGENCY NAME(S) AND ADDRESS(ES) 10. SPONSOR/MONITOR'S ACRONYM(S) SPONSOR/MONITOR'S REPORT NUMBER(S) DISTRIBUTION/AVAILABILITY STATEMENTApproved for public release; distribution is unlimited. SUPPLEMENTARY NOTES ABSTRACTThe hypothesis of this report is that delivery accuracy of small-diameter spin-stabilized projectiles can be improved through novel guidance and control techniques using low-cost components. A gyroscopically stable projectile equipped with a strap-down detector and rotary actuation assembly is introduced. Flight models are formulated to enable nonlinear simulation. The unique guidance challenges posed by characteristics of spin-stabilized flight dynamics such as limit cycles, center-ofgravity swerve, instability, and practical feedback are illustrated. New guidance and control techniques to circumvent these difficulties are proposed. Modeling, parameter estimation, and stability analysis results underpin control design. Representative feedback, control commands, and flight behaviors from nonlinear simulations demonstrate the efficacy of this guidance approach. Monte Carlo analysis shows more than a factor of two in accuracy improvement of the guided over the ballistic flight. These results indicate that delivery system improvements are achievable in small, gyroscopically stable projectiles containing low-cost guidance elements using integrated control formulations. iii SUBJECT TERMS

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“…Beliveau et al [11] characterized experimentally the response times and linearity of output signals of several commercial accelerometers to shock loads up to 70 kg. Brown et al [12], [13] studied MEMS sensors subjected to harsh environments. Tanner et al [14] tested MEMS microengines against shock pulses of various time durations and amplitudes and observed broken mechanical components, e.g., gear anchor, pin joint, and linkage arm, in their comb-drive actuators.…”

Section: Mechanical Fracturementioning

confidence: 99%

MEMS Reliability Review

Huang

Vasan

Doraiswami

et al. 2012

IEEE Trans. Device Mater. Relib.

163

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Abstract-Microelectromechanical systems (MEMS) represents a technology that integrates miniaturized mechanical and electromechanical components (i.e., sensors and actuators) that are made using microfabrication techniques. MEMS devices have become an essential component in a wide range of applications, ranging from medical and military to consumer electronics. As MEMS technology is implemented in a growing range of areas, the reliability of MEMS devices is a concern. Understanding the failure mechanisms is a prerequisite for quantifying and improving the reliability of MEMS devices. This paper reviews the common failure mechanisms in MEMS, including mechanical fracture, fatigue, creep, stiction, wear, electrical short and open, contamination, their effects on devices' performance, inspection techniques, and approaches to mitigate those failures through structure optimization and material selection.

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Strap-down microelectromechanical (MEMS) sensors for high-g munition applications

Cited by 106 publications

References 4 publications

Investigation of the response of microstructures under the combined effect of mechanical shock and electrostatic forces

Investigation of the response of microstructures under the combined effect of mechanical shock and electrostatic forces

Guidance and Control of a Man-Portable Precision Munition Concept

MEMS Reliability Review

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