Metalizing three-dimensional (3D)-printed polymers has
been spotlighted
in the field of manufacturing high-end and customized electrical components.
Conventional metalization approaches that rely on the electroless
plating (ELP) process typically require the use of noble metal-based
catalysts or involve multistep processes, limiting their practical
applications. Herein, we propose a straightforward yet effective approach
to manufacture 3D-printed polymers with conductive metal layers through
a thiol-mediated ELP process without involving an additional catalytic
activation process. A photocurable ternary resin based on thiol-ene-acrylate
monomers was precisely designed to induce excess thiol moieties on
the surface of 3D-printed structures. These exposed thiol moieties
served as active sites for metal ion complexion via strong metal–sulfur
bonds, allowing the deposition of metal layers on the 3D-printed polymers
through the ELP. Diverse metal layers, including Cu, Ag, and NiP,
could be deposited onto virtually any 3D-printed structures with high
uniformity and adhesion stability. To highlight the potential application
of our approach, we fabricated fully functional glucose sensors through
the deposition of the Cu layer on 3D-printed electrode models, and
these sensors displayed excellent nonenzymatic glucose sensing performance.
The proposed approach offers great insights for designing functional
metallic structures and opens up new avenues for manufacturing lightweight,
customized electrical components.