Strength Analysis of Resin Delamination of Packaging Structure of Power Module

Teradaira, Sho; Furuyama, Yukichi; Yu, Qiang

doi:10.1109/itherm.2018.8419594

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2018

DOI: 10.1109/itherm.2018.8419594

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Strength Analysis of Resin Delamination of Packaging Structure of Power Module

Sho Teradaira

Yukichi Furuyama

Qiang Yu

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Strength Analysis of Resin Delamination of Packaging Structure of Power Module

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References 4 publications

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