Strength and fatigue of dispersion-strengthened copper

Miller, Tori; Zinkle, S.J.; Chin, B.A.

doi:10.1016/0022-3115(91)90076-j

Cited by 57 publications

(15 citation statements)

References 6 publications

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“…Yield strengths of ODS alloys are shown in Figure 2. [15][16][17][18][19][20] Most of these data were obtained on GlidCop AL-15 and Al-20, which have lower strengths than the Al-25 and Al-60 alloys. The room temperature yield strength varies between 300 and 600 MPa, mainly due to different amounts of cold work (31% to 80 CW) prior to testing.…”

Section: B Yield Strengthmentioning

confidence: 99%

“…[15][16][17][18][19][20] (31 -80% Cold Work) Figure 3 -Temperature effect on the yield strength of Cu-Cr-Zr alloys [5,21] Figure 4 -Steady-state thermal creep laws for copper alloys [11,14,[23][24][25][26][27][28][29][30] Figure 6 -Cyclic stress-strain curves of copper alloys at ambient temperature [36,38] Figure 7(a) -Fatigue lifetime of copper alloys, based on total strain amplitude [3,6,8,42] Cu-Cr-Zr at 216 °C (Thomas, 1993) Cu-Cr-Zr at 300 °C (Taubenlat, 1984) Cu-Cr-Zr at 300 °C (Gorynin et al, 1992) GlidCop Al15 at 400 °C (Stephens et al, 1988) GlidCop Al15 at 472 °C (Broyles et al, 1996) Applied Stress (ksi) Figure 4 -Steady-state thermal creep laws for copper alloys [11,14,[23][24][25][26][27][28][29][30] 0.001 Figure 6 -Cyclic stress-strain curves of copper alloys at ambient temperature [36,38] …”

Section: List Of Figuresmentioning

confidence: 99%

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Modeling creep and fatigue of copper alloys

Thomas

Stubbins

2000

Metall Mater Trans A

119

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This paper reviews expressions to quantify thermal creep and fatigue lifetime for four copper alloys, Cu-Ag-P, Cu-Cr-Zr, Cu-Ni-Be and Cu-Al 2 O 3 . These property models are needed to simulate the mechanical behavior of structures with copper components that are subjected to high heat flux and fatigue loading conditions, such as molds for the continuous casting of steel and the first wall in a fusion reactor. Then, measurements of four-point bending fatigue tests were conducted on two-layered specimens of copper alloy and stainless steel, and thermal ratchetting behavior was observed at 250 °C. The test specimens were modeled with a two-dimensional elastic-plastic-creep finite-element model using ABAQUS. To match the measurements, a primary thermal creep law was developed for Cu-0.28% Al 2 O 3 for stress levels up to 500 MPa, and strain rates from 10 -8 -10

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Section: B Yield Strengthmentioning

confidence: 99%

Section: List Of Figuresmentioning

confidence: 99%

Modeling creep and fatigue of copper alloys

Thomas

Stubbins

2000

Metall Mater Trans A

119

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“…12. Relationship between temperature and yield stress of copper [32]. schematic diagram was given in Fig.…”

Section: Residual Stress Analysis Of Igbt Module On Copper Microchannmentioning

confidence: 99%

Modeling and simulation of power electronic modules with microchannel coolers for thermo-mechanical performance

Xu¹,

Liu²,

Liu³

2014

Microelectronics Reliability

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“…(1-3) represent are shown in Table . [17]. The Anand model parameters of SAC305 are shown in Table . In this study the material properties for the DBC copper layers were adopted from Dong and Miller, as shown in Table [18,19]. The other material properties of alumina, SAC 305 and copper are listed in Table . Besides, it was assumed that the coefficient of thermal expansion of copper layers in DBC was temperature dependent and the CTE of SAC305 and alumina was temperature independent, as shown in Fig.…”

Section: B Materials Propertiesmentioning

confidence: 99%

Effect of micro-channel on warpage and residual stress due to reflow process in IGBT modules

Zhang

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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With the trend to be smaller, more integration and higher power in power electronic technology, the cooling problem has become increasingly prominent for those high power devices. Micro-channel in substrate, as an effective cooling method, has been proposed and investigated by many researchers in recent years. Warpage and stress, naturally existing in all the packaging processes due to the unavoidable mismatch of coefficient of thermal expansion (CTE) between materials, can be problematic on reliability. Compared to the traditional substrate, the substrate integrated with micro-channel maybe result in the increase of the warpage and residual stress after packaging processes. In this paper a 1200V Insulated Gate Bipolar Transistor (IGBT) module as a prototype was investigated to describe effects of the microchannel on warpage and residual stress of the substrate due to reflow process. Finite element analysis method with viscoplastic solder model was used to study the reflow process. The Anand constitutive model, which has been adopted successfully to represent the viscoplastic behavior of solder materials, was used to model the material properties of SAC305 solder layers in this study. The whole reflow process was modeled by element "death and activation" technology, and the traditional substrate model and the model of the substrate integrated with microchannel were taken for comparison. The effect of the size and the arrangement of the micro-channel in substrate on warpage and residual stresses after reflow process were also studied.

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Strength and fatigue of dispersion-strengthened copper

Cited by 57 publications

References 6 publications

Modeling creep and fatigue of copper alloys

Modeling creep and fatigue of copper alloys

Modeling and simulation of power electronic modules with microchannel coolers for thermo-mechanical performance

Effect of micro-channel on warpage and residual stress due to reflow process in IGBT modules

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