Strength and leak testing of plasma activated bonded interfaces

Visser, M M; Weichel, S.; Reus, R. de; Hanneborg, A.

doi:10.1016/s0924-4247(02)00047-x

Cited by 24 publications

(19 citation statements)

References 11 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This is comparable to the strength of glass-silicon bonds of 10-15 and up to 30 MPa reported in the literature (Lee Obermeier 1995). The bond strengths of 12-18 MPa obtained in this work are higher than the 6-10 MPa reported for anodic bonding to thin-film deposited glass (Visser et al 2002a), the 10 MPa reported for gold thermo compression bonding (Taklo et al 2004), and the 4-8 MPa reported for plasma activated bonding (Visser et al 2002b). The TEM pictures in Fig.…”

Section: Discussioncontrasting

confidence: 59%

Anodic bonding of glass to aluminium

et al. 2005

View full text Add to dashboard Cite

Anodic bonding of glass to aluminium may provide a higher degree of freedom in device design. In this paper, a systematic variation of the bonding parameters for the aluminium-glass bond is presented. Hermetic seals with strengths of 18.0 MPa can be achieved using a 50-100-nm-thick bonding aluminium layer, and bonding at 300-400°C applying a voltage of 1,000-1,500 V for 20 min. With these parameters, bond yields above 95.1% were obtained on 17 wafers. The bonds survived extensive thermal ageing without significant degradation. The possibility of bonding glass to an aluminium layer with buried, electrically isolated conductors underneath is also demonstrated.

show abstract

Section: Discussioncontrasting

confidence: 59%

Anodic bonding of glass to aluminium

et al. 2005

View full text Add to dashboard Cite

show abstract

“…13 Therefore, tensile and shear strength measurements were performed in the current work. The average tensile strengths obtained on the presented structures are similar to the 9.0 MPa found by Visser et al, 8 and higher than the 4.6 MPa found earlier by our group. 13 The student t test using a 95% confidence interval showed that the there was no statistically significant difference between the tensile or shear strengths for the different frame widths.…”

Section: Discussionsupporting

confidence: 90%

“…22 Visser et al found a maximum leak rate of 8 × 10 -13 mbar·l·s −1 for low-temperature direct Si-Si bonded seals of width 20-70 μm. 8 There is no disagreement between these three estimates, as they all represent maxima, limited by their respective measurement technique. In all three cases, the actual leak rate could be significantly lower.…”

Section: Discussionmentioning

confidence: 96%

Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints

Schjølberg-Henriksen

Malik

Gundersen

et al. 2015

ECS J. Solid State Sci. Technol.

View full text Add to dashboard Cite

The electrical, mechanical, and hermeticity properties of low-temperature, plasma activated direct silicon bonds were investigated. On individual dies with a bonding area ranging from 1-4 mm 2 , the bonded interface was found to have a capacitance ranging from 2.62 pF/mm 2 -2.89 pF/mm 2 at 1 kHz. Linear I-V curves showed ohmic behavior without hysteresis. A resistance around 2.2 and a current density of 1.1 × 10 4 A/m 2 was measured at DC. We speculate that the capacitive and resistive responses are related to traps that are formed during the plasma activation process. The applied bonding process resulted in hermetic sealing with 100% yield on 2 × 481 dies. The maximum leak rate of the seals was 2.4 × 10 −11 mbar·l·s −1 , but could be significantly lower. No gross leaks were observed following a steady-state life test, a thermal shock test, and a moisture resistance test applied on 100 dies.

show abstract

“…In the literature, there is evidence of a beneficial aging effect, where bond strength improves over the course of days and weeks for wafers stored in room conditions [14], [29], [35]. Thus, bonded wafers were allowed to rest for 12 days before further processing.…”

Section: G Surface Cleaning Plasma Activation and Direct Bondingmentioning

confidence: 99%

The Nanoaquarium: A Platform for In Situ Transmission Electron Microscopy in Liquid Media

Grogan

Bau

2010

J. Microelectromech. Syst.

125

123

View full text Add to dashboard Cite

Transmission electron microscopes (TEMs) and scanning transmission electron microscopes (STEMs) are powerful tools for imaging on the nanoscale. These microscopes cannot be typically used to image processes taking place in liquid media because liquid simply evaporates in the high-vacuum environment of the microscope. In order to view a liquid sample, it is thus necessary to confine the liquid in a sealed vessel to prevent evaporation. Additionally, the liquid layer must be very thin to minimize electron scattering by the suspending medium. To address these issues, we have developed a flow cell with a height of tens of nanometers, sandwiched between two thin silicon nitride membranes. The cell is equipped with electrodes for actuation and sensing. The cell is thin enough to allow the transmission of electrons and the real-time imaging of nanoparticles suspended in liquid. This paper details the fabrication process, which relies on plasma-activated wafer bonding. Some of the advantages of our nanoaquarium include the thinnest observation chamber of any reported in situ TEM/STEM device, integrated electrodes for sensing and actuation, and wafer-scale processing that allows bulk device production. Device performance was demonstrated by STEM imaging of gold and polystyrene nanoparticles suspended in water with excellent resolution. Potential applications of the device include imaging of colloidal crystal formation, aggregation, nanowire growth, electrochemical deposition, and biological interactions.[ 2010-0023]Index Terms-Electron microscopy, fluidics, in situ, nanotechnology, wafer bonding.

show abstract

Strength and leak testing of plasma activated bonded interfaces

Cited by 24 publications

References 11 publications

Anodic bonding of glass to aluminium

Anodic bonding of glass to aluminium

Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints

The Nanoaquarium: A Platform for In Situ Transmission Electron Microscopy in Liquid Media

Contact Info

Product

Resources

About