2014
DOI: 10.4071/hitec-tha25
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Strength and Reliability of High Temperature Transient Liquid Phase Sintered Joints

Abstract: Low-temperature transient liquid phase sintering (LT-TLPS) can be used to form high-temperature joints between metallic interfaces at low process temperatures. In this paper, we will describe the processing and shear strength, along with the shock fatigue resistance of sintered joints made by this process. Joints made from different ratios of Ni and Cu high melting temperature constituents paired with Sn-based low melting temperature constituents have been evaluated. For the shear studies, the softening behavi… Show more

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Cited by 10 publications
(6 citation statements)
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“…No such cracks have appeared in Cu-Sn TLPS joints between Cu-substrates [18,19,21,22] or Ni-Sn joints between Ni-substrates [25][26][27] under identical process conditions. This indicates that thermomechanical loads induced by CTE mismatch between the TLPS joint, the diode, and the substrate, in combination with temperature gradients between sintering and ambient, are the source of the crack formation.…”
Section: Sample Preparation and Failure Analysismentioning
confidence: 99%
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“…No such cracks have appeared in Cu-Sn TLPS joints between Cu-substrates [18,19,21,22] or Ni-Sn joints between Ni-substrates [25][26][27] under identical process conditions. This indicates that thermomechanical loads induced by CTE mismatch between the TLPS joint, the diode, and the substrate, in combination with temperature gradients between sintering and ambient, are the source of the crack formation.…”
Section: Sample Preparation and Failure Analysismentioning
confidence: 99%
“…This decouples the process completion time from the joint thickness, because the required IMC thickness is equal to the short distance between high-melting temperature particles. Because of these advantages, considerable research has been pursued on the Cu-Sn [14][15][16][17][18][19][20][21][22] and Ni-Sn [18,[23][24][25][26][27] material systems in the last years.…”
Section: Introductionmentioning
confidence: 99%
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“…The AgSn-TLP configuration, indeed, offers one major advantage is that it produces on two IMC phases, Ag 3 Sn (e-phase) and Ag 5 Sn (z-phase) and exhibits a tendency for Kirkendall void during the IMC (Ag 3 Sn ! z) transformation (Lis and Leinenbach, 2015;Mokhtari, 2019;Moeini et al, 2014;Feißt et al, 2019aFeißt et al, , 2019b. This ends up with a relatively high melting point of the AgSn TLP bonds (Sun et al, 2020;Rheingans et al, 2022).…”
Section: Introductionmentioning
confidence: 99%
“…Consequently, the Ag-Sn-Ag configuration is heated to a temperature above the melting point of the Sn allowing for the diffusion process between the solid–liquid phase to initiate, resulting in a thermally stable bonds (Feißt et al , 2018). The AgSn-TLP configuration, indeed, offers one major advantage is that it produces on two IMC phases, Ag 3 Sn ( ϵ -phase) and Ag 5 Sn ( ζ -phase) and exhibits a tendency for Kirkendall void during the IMC (Ag 3 Sn → ζ ) transformation (Lis and Leinenbach, 2015; Mokhtari, 2019; Moeini et al , 2014; Feißt et al , 2019a, 2019b). This ends up with a relatively high melting point of the AgSn TLP bonds (Sun et al , 2020; Rheingans et al , 2022).…”
Section: Introductionmentioning
confidence: 99%