Strength Enhancement and Application Development of Carbon Foam for Thermal Protection Systems

Duston, Christopher; Seghi, Steve; Watts, R.J.

doi:10.21236/ada461309

Cited by 8 publications

(3 citation statements)

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“…Studies had shown that the typical interlayer spacing is 0.34 nm which is very close to perfect graphite. Thermal conductivities along the ligament were calculated to be approximately 1700 W/m·K [27], suggesting it can significantly improve the loss of fin efficiency as compared to typical metal foam. For more details about the carbon foam, interested readers are resorted to the review article by Wang et al [28] who had made a thorough review concerning the potential in thermal management of carbon foam.…”

Section: Problems Of Heat Sink For Housing More Fin Surfacesmentioning

confidence: 99%

A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress

Wang

2017

Inventions

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Abstract:This study provides an overview regarding enhancement of an air-cooled heat sink applicable for electronic cooling subject to cross-flow forced convection. Some novel designs and associated problems in air-cooled heat sinks are discussed, including the drawback of adding surfaces, utilization of porous surfaces such as metal foam or carbon foam, problems and suitable applicable range of highly interrupted surfaces (louver or slit) and longitudinal vortex generator. Though the metal foam may accommodate significant surface area, it is comparatively ineffective for air-cooling application due to its much lower fin efficiency, and this shortcoming can be improved by integrating with solid fin. For highly dense fin spacing (e.g., <1.0 mm), cannelure or grooved surface may be a better choice, and fin structure with periodic contraction and expansion may not be suitable for it introduces additional pressure drop penalty. The partial bypass concept, which manipulates a larger temperature difference at the trailing part of heat sink, can be implemented to significantly reduce the pressure drop. Through some certain niche operation, t the thermal resistance of the partial bypass heat sink may be superior to the conventional heat sink. The trapezoid fin surface featuring easier manufacturing and a smaller weight is shown to have competitive performance against traditional rectangular fin geometry. The IPFM (Interleaved Parallelogram Fin Module) design which combines two different geometrical fins with the odd number fins being rectangular shape, and parallelogram shape in even fin numbers, shows 8%-12% less surface than conventional design but still offers a lower thermal resistance than the conventional rectangular heat sink in lower flowrate operation. The cross-cut design shows appreciable improvements as compared to the conventional plate fin design especially in high velocity regime and the single cross-cut heat sinks are superior to multiple cross-cut heat sinks.

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Section: Problems Of Heat Sink For Housing More Fin Surfacesmentioning

confidence: 99%

A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress

Wang

2017

Inventions

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“…[2][3][4][5][6][7][8][9] The metallic HX demonstrator developed by NASA-JSC was used as a baseline HX for this study. The metallic demonstrator was designed and fabricated by a private company and details of the core design were not available.…”

Section: Introductionmentioning

confidence: 99%

Advances in the Lightweight Air-Liquid Composite Heat Exchanger Development for Space Exploration Applications

Shin

Johnston

Haas

2011

41st International Conference on Environmental Systems

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An advanced, lightweight composite modular Air/Liquid (A/L) Heat Exchanger (HX) Prototype for potential space exploration thermal management applications was successfully designed, manufactured, and tested. This full-scale Prototype consisting of 19 modules, based on recommendations from its predecessor Engineering Development unit (EDU) but with improved thermal characteristics and manufacturability, was 11.2 % lighter than the EDU and achieves potentially a 42.7% weight reduction from the existing state-of-the-art metallic HX demonstrator. However, its higher pressure drop (0.58 psid vs. 0.16 psid of the metal HX) has to be mitigated by foam material optimizations and design modifications including a more systematic air channel design. Scalability of the Prototype design was validated experimentally by comparing manufacturability and performance between the 2-module coupon and the 19-module Prototype. The Prototype utilized the thermally conductive open-cell carbon foam material but with lower density and adopted a novel highefficiency cooling system with significantly increased heat transfer contact surface areas, improved fabricability and manufacturability compared to the EDU. Even though the Prototype was required to meet both the thermal and the structural specifications, accomplishing the thermal requirement was a higher priority goal for this first version. Overall, the Prototype outperformed both the EDU and the corresponding metal HX, particularly in terms of specific heat transfer, but achieved 93.4% of the target. The next generation Prototype to achieve the specification target, 3,450W would need 24 core modules based on the simple scaling factor. The scale-up Prototype will weigh about 14.7 Kg vs. 21.6 Kg for the metal counterpart. The advancement of this lightweight composite HX development from the original feasibility test coupons to EDU to Prototype is discussed in this paper.

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“…Implementation of carbon foam into various thermal management systems has been prohibited by its inherent low strength and friability. Duston and Seghi(2004) shown that when a silicon carbide coating was applied via polymeric precursor to the carbon foam, the compressive strength was increased 2.5 times while reducing the thermal conductivity by only 5%. Experimental set-up consists of two copper pipes of thickness 3mm.…”

Section: Introductionmentioning

confidence: 99%

Experimental Investigation for Natural Convection Heat Transfer Enhancement by Porous Medium

Dongre

Wankhede

2010

2010 3rd International Conference on Emerging Trends in Engineering and Technology

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A porous medium enhancement of convective heat transfer results from the passage of fluid through the open, interconnected void structure, exposing the fluid to large surface area. Many international papers are studied to verify the potential of porous carbon foam in thermal management systems. This was proved experimentally by comparing a bare copper pipe and copper pipe wrapped with porous carbon foam. With the same heat input; porous carbon foam has shown a noticeable enhancement (30 to 55%) in convective heat transfer. The properties of porous carbon foam and its production processes are also discussed. The results are presented with the help of suitable graphs and the phenomenon of heat transfer enhancement is explained in detail.

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Strength Enhancement and Application Development of Carbon Foam for Thermal Protection Systems

Cited by 8 publications

References 0 publications

A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress

A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress

Advances in the Lightweight Air-Liquid Composite Heat Exchanger Development for Space Exploration Applications

Experimental Investigation for Natural Convection Heat Transfer Enhancement by Porous Medium

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