In the development of adhesives,
an understanding of the fracture
behavior of the bonded joints is inevitable. Two typical failure modes
are known: adhesive failure and cohesive failure. However, a molecular
understanding of the cohesive failure process is not as advanced as
that of the adhesive failure process. In this study, research was
developed to establish a molecular understanding of cohesive failure
using the example of a system in which epoxy resin is bonded to a
hydroxyl-terminated self-assembled monolayer (SAM) surface. Adhesive
failure was modeled as a process in which an epoxy molecule is pulled
away from the SAM surface. Cohesive failure, on the other hand, was
modeled as the process of an epoxy molecule separating from another
epoxy molecule on the SAM surface or breaking of a covalent bond within
the epoxy resin. The results of the simulations based on the models
described above showed that the results of the calculations using
the model of cohesive failure based on the breakdown of intermolecular
interactions agreed well with the experimental results in the literature.
Therefore, it was suggested that the cohesive failure of epoxy resin
adhesives is most likely due to the breakdown of intermolecular interactions
between adhesive molecules. We further analyzed the interactions at
the adhesive failure and cohesive failure interfaces and found that
the interactions at the cohesive failure interface are mainly accounted
for by dispersion forces, whereas the interactions at the adhesive
failure interface involve not only dispersion forces but also various
chemical interactions, including hydrogen bonds. The selectivity between
adhesive failure and cohesive failure was explained by the fact that
varying the functional group density affected the chemical interactions
but not the dispersion forces.