Polyimides rank among the most heat-resistant polymers and are widely used in high temperature plastics, adhesives, dielectrics, photoresists, nonlinear optical materials, membrane materials for separation, and Langmuir-Blodgett (LB) films, among others. While there is a variety of high temperature polyimides, there is a demand for utilizing these materials at higher and higher temperatures in oxidizing and aggressive environments. Therefore, we sought to use materials which do not oxidize to enhance properties of the polyimide composition maintaining polyimide weights and processing adva ntages. In this paper we introduced results of utilizing inorganic nanostructured silicon carbide particles to produce an inorganic particle filled polyimide.