Stress analysis and optimization of pop package under random vibration loading

Abstract

The stress analysis of packaging on packaging (POP) under random vibration loading is conducted using the finite element model. The effect of structural parameters on solder joint stresses is analyzed by sensitivity analysis. Stress fitting is performed using the response surface method (RSM), and the optimization module is used to optimize the structural parameters of POP packaging. The results demonstrate a reduction of 0.016 and 0.0031 MPa in upper and lower solder joint stresses, respectively. This optimization of the structural parameters improves the reliability of the electronic packaging structure.