Stress analysis in scratching of anisotropic single-crystal silicon carbide

Wang, Peizhi; Ge, Peng; Liu, Tengyun; Gao, Yufei

doi:10.1016/j.ijmecsci.2018.03.042

Cited by 36 publications

(3 citation statements)

References 30 publications

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“…During the scratch process of brittle materials, the initiation and propagation of the cracks were determined by the stresses σ x , σ y and σ z [35]. To simplify the analysis of the stress field distribution, the calculated stress field was normalized as σd 2 /F n , where d is the scratch depth.…”

Section: Stress Field Induced By the Scratchmentioning

confidence: 99%

Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF₂ single crystals

Piao

Zhang

et al. 2022

Int. J. Extrem. Manuf.

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To understand the anisotropy dependence of the damage evolution and material removal during the machining process of MgF2 single crystals, nanoscratch tests of MgF2 single crystals of different crystal planes and directions were systematically performed, and surface morphologies of scratched grooves under different conditions were analyzed. The experimental results indicated that the anisotropy had a significant influence on the damage evolution in the machining process of MgF2 single crystals. The stress field model induced by the scratch was developed by considering the anisotropy, which indicated that median cracks induced by the tensile stress initiated and propagated at the front of the indenter during the loading process. Lateral cracks induced by tensile stress initiated and propagated on the subsurface during the unloading process. In addition, surface radial cracks induced by the tensile stress were easy to generate during the unloading process. The stress change led to the deflection of the propagation direction of lateral cracks, so that the lateral cracks propagated to the workpiece surface and resulted in the brittle removal in the form of chunk chips. The plastic deformation parameter indicated that the more slip systems were activated, the more easily plastic deformation occurred. The cleavage fracture parameter indicated that the cracks propagated along the activated cleavage planes, and the brittle chunk removal was caused by the subsurface cleavage cracks propagating to the crystal surface. Under the same processing parameters, the scratch of the (001) crystal plane along the [100] crystal-orientation is most conducive to achieving the plastic machining of MgF2 single crystals. The theoretical results agreed well with the experimental results, which will not only enhance the understanding of anisotropy dependence of damage evolution and removal process during machining of MgF2 crystals, but also provide a theoretical foundation for achieving the high-efficiency and low-damage processing of anisotropy single crystals.

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Section: Stress Field Induced By the Scratchmentioning

confidence: 99%

Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF₂ single crystals

Piao

Zhang

et al. 2022

Int. J. Extrem. Manuf.

View full text Add to dashboard Cite

show abstract

“…It can meet the new requirements of modern electronic technology for high temperature, high voltage, high frequency, high power, and radiation resistance [1,2]. Therefore they have a broad application prospect in the eld of microelectronics [3]. However, their high hardness and brittleness become the bottleneck of their development [4].…”

Section: Introductionmentioning

confidence: 99%

Experimental investigations on optimizing manufacturing parameters for electrospark deposition diamond wire saw

Wang

2022

Int J Adv Manuf Technol

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The third generation of superhard semiconductor materials, represented by single-crystal SiC, is used widely in microelectronics due to their excellent physical and mechanical properties. However, their high hardness and brittleness become the bottleneck of their development. Diamond wire saw (DWS) has become the mainstream tool for sawing hard and brittle crystal materials. However, the diamond abrasive is consolidated on the core wire through resin or electroplated nickel, and the holding strength is not high. When sawing superhard crystal materials, the e ciency is low. In order to improve the sawing e ciency of superhard crystal materials, it is of great signi cance to improve the wear resistance of wire saw and the holding strength of abrasive particles. Electro-spark deposition (ESD) can deposit electrode materials on the substrate with low heat input to achieve metallurgical bonding between metal materials. It can effectively improve the gripping strength of the abrasive grains. And the sawing ability of the wire saw to make the consolidated DWS by the ESD process. In this paper, the ESD equipment has been designed according to the characteristics of the ESDDWS process. The discharge gap size and electrode consumption are monitored in real-time by a single-chip microcomputer (SCM). Orthogonal experiments were carried out for the two motion modes. The effects of process parameters, such as (A) Grain size, (B) Abrasive content, (C) Pulse duration time, (D) Compacting pressure, (E) Current, (F) Electrode diameter, (G) Pulse interval time, (H) Reciprocating times, (I) Wire feed speed, on the quality of ESDDWS were analyzed.Through the extremum difference analysis, the optimal parameter combinations of ESDDWS were obtained. The results of the validation experiment are better than the original experimental results.

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“…Of particular importance is to assess the priority effect of competitive processes on the resulting deformation and fracture of cubic materials: the effect of dislocation structures in slip planes, porosity, maximum strain rates and anisotropy of their mechanical characteristics. Simulation and experimental data on the elastic and plastic deformation of cubic single crystals under static loading are reported elsewhere [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15]. Among the studies of cubic single crystals in static statements are those that analyse their elastic properties in micro-indentation [16] and that suggest averaging schemes for finding their isotropic equivalent elastic modulus [17].…”

Section: Introductionmentioning

confidence: 99%

Mathematical simulation of elastoplastic deformation in cubic materials with an account of anisotropic bulk compressibility

Krivosheina

Tuch

2021

Mathematics and Mechanics of Solids

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It was shown for the first time that when modelling the deformation of materials with cubic symmetry (at full stress), the rotation of the computational axes leads to the identification of anisotropic volumetric compressibility. Loading of the materials with cubic symmetry of properties in the directions not coincided with the main directions (for example, 011) allows one to detect 75% cases of the auxetic single crystals (i.e. with negative Poisson’s ratio). In these cases, the negative volumetric compressibility has anisotropy, in contrast to the volumetric compressibility calculated along the crystallographic axes for cubic materials. Anisotropy of the volumetric compressibility leads to anisotropy of velocities of propagation of body waves. This paper considers several elastoplastic problems for a cubic material with different orientations of a coordinate system about its crystallographic axes. The behaviour of such a material under dynamic loads is modelled with an account of anisotropic bulk compressibility to provide the same anisotropy of bulk wave velocities in the elastic and plastic ranges and a uniform pressure function at the elastic-to-plastic strain transition. For each orientation of the coordinate system and respective planes, different values at the indicatrices of elastic constants are specified, and this specifies different deformation processes in cubic materials. Such an effect is demonstrated by solving three problems in three-dimensional (3D) statements approximating the following processes: (1) one-dimensional elastoplastic deformation in a thin target impacted by a thin plate; (2) uniform compression in a spherical body under pulsed hydrostatic pressure; and (3) 3D elastoplastic deformation in a cylindrical body striking a rigid target in view of anisotropic bulk compressibility. The problems were solved numerically using original programs based on the finite element method modified by GR Johnson for impact problems. Solving problems in a 3D formulation makes it possible to take into account the dependences of the direction of the elastic and plastic characteristics of the material, as well as the velocities of propagation of elastic and plastic waves from that direction. The simulation results suggest that for cubic materials, changing the orientation of two coordinate axes in a plane changes the strains along all three axes, including those perpendicular to this plane. It is concluded that anisotropic bulk compressibility in cubic materials should be allowed for by mathematical models of their elastic and plastic deformation. We demonstrate that the orientation of a computational coordinate system for cubic materials should be in those directions in which their deformation is analysed in each particular case.

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Stress analysis in scratching of anisotropic single-crystal silicon carbide

Cited by 36 publications

References 30 publications

Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF₂ single crystals

Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF₂ single crystals

Experimental investigations on optimizing manufacturing parameters for electrospark deposition diamond wire saw

Mathematical simulation of elastoplastic deformation in cubic materials with an account of anisotropic bulk compressibility

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Stress analysis in scratching of anisotropic single-crystal silicon carbide

Cited by 36 publications

References 30 publications

Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF2 single crystals

Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF2 single crystals

Experimental investigations on optimizing manufacturing parameters for electrospark deposition diamond wire saw

Mathematical simulation of elastoplastic deformation in cubic materials with an account of anisotropic bulk compressibility

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Product

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Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF₂ single crystals

Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF₂ single crystals