2009
DOI: 10.1016/j.jallcom.2008.02.080
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Stress analysis of ceramic insulation coating on Cu/MgB2 wires for W&R MgB2 coils

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Cited by 5 publications
(2 citation statements)
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“…It is also an effective method for improving the performance of high-temperature electromagneticwire conductor materials by using some excellent metal compounds at high temperatures, such as Nb 3 Sn and MgB 2 , to coat copper wire. Covering metal compounds with excellent oxidation resistance can prevent the diffusion of copper at high temperatures and ensure the insulation performance of electromagnetic wire at high temperatures [64,65]. Cr is also a material with excellent oxidation resistance at high temperatures, but the manufacturing cost of chromium coating is too expensive [66].…”
Section: Inorganic Insulation Type For High-temperature-resistant Ele...mentioning
confidence: 99%
“…It is also an effective method for improving the performance of high-temperature electromagneticwire conductor materials by using some excellent metal compounds at high temperatures, such as Nb 3 Sn and MgB 2 , to coat copper wire. Covering metal compounds with excellent oxidation resistance can prevent the diffusion of copper at high temperatures and ensure the insulation performance of electromagnetic wire at high temperatures [64,65]. Cr is also a material with excellent oxidation resistance at high temperatures, but the manufacturing cost of chromium coating is too expensive [66].…”
Section: Inorganic Insulation Type For High-temperature-resistant Ele...mentioning
confidence: 99%
“…Among these methods, sol-gel method can be performed at room temperature, which is advantageous because it is more homogeneous, inexpensive, simple method to control the composition of nano particle and films [15][16][17][18]. Nevertheless, the sol-gel nanoparticles and & E. Asikuzun easikuzun@kastamonu.edu.tr films have some failures which stem from the processing parameters, drying, heat treatment and annealing condition [19][20][21]. These failures establish stress based on the difference in the physical and mechanical properties of the elements that connect temperature regime of the product of the nanoparticles.…”
Section: Introductionmentioning
confidence: 99%