1999
DOI: 10.1016/s0040-6090(99)00448-4
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Stress and oxidation in CuNi thin films

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Cited by 14 publications
(4 citation statements)
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“…Resistivity of printed Cu 0.8 Ni 0.2 structures decreases slightly due to sintering in the temperature range of 300-600°C (ρ09.73·10 −1 -1.61·10 −1 Ωm); after sintering at 700°C, ρ drops to 9.42·10 −6 Ωm then decreases further to 1.05·10 −6 Ωm at 800°C. Resistivity values obtained after sintering at 800°C are equal or two times higher than that of the bulk phase Constantan (CuNi44Mn1, ρ05·10 −7 Ωm) [40] and about 7-13 times lower than the earlier published 7.3·10 −6 Ωm of Ni-Cu thick film by Songping et al [9]. The microstructure of printed Cu 0.5 Ni 0.5 and Cu 0.8 Ni 0.2 layers was studied by SEM.…”
Section: Printed and Sintered Alloy Structuresmentioning
confidence: 83%
“…Resistivity of printed Cu 0.8 Ni 0.2 structures decreases slightly due to sintering in the temperature range of 300-600°C (ρ09.73·10 −1 -1.61·10 −1 Ωm); after sintering at 700°C, ρ drops to 9.42·10 −6 Ωm then decreases further to 1.05·10 −6 Ωm at 800°C. Resistivity values obtained after sintering at 800°C are equal or two times higher than that of the bulk phase Constantan (CuNi44Mn1, ρ05·10 −7 Ωm) [40] and about 7-13 times lower than the earlier published 7.3·10 −6 Ωm of Ni-Cu thick film by Songping et al [9]. The microstructure of printed Cu 0.5 Ni 0.5 and Cu 0.8 Ni 0.2 layers was studied by SEM.…”
Section: Printed and Sintered Alloy Structuresmentioning
confidence: 83%
“…[14]. For annealing temperatures similar to ours, some times the separation of NiO and CuO results in the formation of a double layer [15]. This can not be supported only by the XRD data and cross section transmission electron microscopy experiments are needed.…”
Section: Resultsmentioning
confidence: 65%
“…In addition, stress due to thermal expansion differences * between film and substrate is less than -9 MPa (compressive). It has been calculated in accordance with the thermal stress equation [13] ( ) . The following pictures (Fig.…”
Section: Ageing Under Mechanical Stress: Load By Four-point Bendingmentioning
confidence: 99%