2022 IEEE International Interconnect Technology Conference (IITC) 2022
DOI: 10.1109/iitc52079.2022.9881280
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Stress and thermal stress evolution in Mo and Ru thin films

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Cited by 2 publications
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“…5) With these advantages, studies on the demonstration of Ru interconnects have been promoted. 6) Since integrating narrow Ru buried rails surrounded by SiO 2 dielectrics requires careful assessment of stress considerations 7) and of exhaust heat considerations, 8,9) large-scale atomistic modeling of Ru interconnect/SiO 2 interlayer dielectric (Ru/SiO 2 -ILD) interfaces is of great importance.…”
Section: Introductionmentioning
confidence: 99%
“…5) With these advantages, studies on the demonstration of Ru interconnects have been promoted. 6) Since integrating narrow Ru buried rails surrounded by SiO 2 dielectrics requires careful assessment of stress considerations 7) and of exhaust heat considerations, 8,9) large-scale atomistic modeling of Ru interconnect/SiO 2 interlayer dielectric (Ru/SiO 2 -ILD) interfaces is of great importance.…”
Section: Introductionmentioning
confidence: 99%