We introduce a simple methodology to predict and tailor the intrinsic bending of a cantilever made of a single thin film of hetero-epitaxial silicon carbide grown on silicon. The combination of our novel method for the depth profiling of residual stress with a few nm resolution with finite element modelling allows for the prediction of the bending behaviour with great accuracy. We also demonstrate experimentally that a silicon carbide cantilever made of one distinct film type can be engineered to obtain the desired degree of either upward, flat, or downward bending, by selecting the appropriate thickness and cantilever geometry. A precise control of cantilever bending is crucial for MEMS applications such as micro-actuators, micro-switches, and resonant sensors. I. INTRODUCTION Epitaxial cubic silicon carbide (3C-SiC) is a leading material for micro electrical mechanical systems (MEMS) due to its excellent mechanical properties when silicon (Si) has limitations. 1-4 Furthermore, it can be grown on Si substrate which results in large area, easy micromachining, and low cost production.