Stress Distribution Around Osseointegrated Implants With Different Internal-Cone Connections: Photoelastic and Finite Element Analysis

Abstract

The goal of this study was to evaluate the distribution of stresses generated around implants with different internal-cone abutments by photoelastic (PA) and finite element analysis (FEA). For FEA, implant and abutments with different internal-cone connections (H- hexagonal and S- solid) were scanned, 3D meshes were modeled and objects were loaded with computer software. Trabecular and cortical bones and photoelastic resin blocks were simulated. The PA was performed with photoelastic resin blocks where implants were included and different abutments were bolted. Specimens were observed in the circular polariscope with the application device attached, where loads were applied on same conditions as FEA. FEA images showed very similar stress distribution between two models with different abutments. Differences were observed between stress distribution in bone and resin blocks; PA images resembled those obtained on resin block FEA. PA images were also quantitatively analyzed by comparing the values assigned to fringes. It was observed that S abutment distributes loads more evenly to bone adjacent to an implant when compared to H abutment, for both analysis methods used. It was observed that the PA has generated very similar results to those obtained in FEA with the resin block.

Photoelastic analysis of stresses transmitted by complete dentures lined with hard or soft liners

“…However, the stress distribution behavior in the supporting structures of the denture (mucosa and alveolar bone) needs further investigations to confirm the results of the current work, in particular, comparing photoelastic method with finite element analysis, as shown in previous study related to osseointegration of implants [36]. It is also possible that the change in the masticatory manner could define other patterns of loading on dentures with respect to induced stresses on the support structures and, therefore, this aspect deserves to be investigated.…”

Photoelastic and finite element stress analysis reliability for implant-supported system stress investigation

“…Such similar results between photoelasticity and FEA were also reported by a previous study that investigated the stresses generated around implants with different internal-cone abutments. 14 Photoelasticity is an experimental analysis and allows the use of real components; therefore, the 3D misfit generated by the casting procedure can be accurately reproduced. 4 In contrast, the reproduction of misfits by FEA is usually simplified by a gap between two components with parallel contact surfaces.…”

“…Among the main methods used for in vitro stress investigation are photoelasticity 2,4 and finite element analysis (FEA). 2,14,15 Photoelasticity provides a qualitative result of the stress distribution and mimics the clinical scenario by using real components (i.e. implants, abutments and frameworks).…”

“…Based on these particularities of the methodologies, previous studies recommended their combined use. 2,14,16 Despite this recommendation, the reliability between photoelasticity and FEA methodologies are not yet well established for the investigation of the biomechanical behavior of the implant-supported system. Thus, a comparison between these two methodologies under the same simulation is warranted.…”

Avaliação da distribuição das tensões ao redor de implantes em diferentes níves de inserção

“…As figuras de 5.11 a 5.14 mostram os corpos de prova contendo o implante (Naves et al, 2013;Sotto-Maior et al, 2014). Como forma de comprovar ou validar esses dados, desenvolveram a mesma comparação para análise de elementos finitos seguindo os mesmos parâmetros dos corpos de prova, e encontrando resultados semelhantes (Anderson e Rayfield, 2012;Anami et al, 2015).…”