Handbook of Sol-Gel Science and Technology 2016
DOI: 10.1007/978-3-319-19454-7_12-1
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Stress Evolution and Cracking in Sol–Gel-Derived Thin Films

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Cited by 4 publications
(6 citation statements)
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“…However, when preparing dense or mesoporous films above 1 μm in thickness by a single coating step, using nanoparticle dispersions or sol−gel precursor solutions, the films are prone to crack during the firing step. 34 The cracking originates most prominently from the in-plane tensile stress development during the annealing, referred to as the intrinsic in-plane stress, which includes solvent evaporation and densification processes shrinking the films to 70% of their initial thickness. 35 During the cooling procedure to room temperature, the difference in the thermal expansion coefficients between the substrate and the film either raises or lowers the in-plane stress observed at room temperature labeled as the residual in-plane stress.…”
Section: ■ Introductionmentioning
confidence: 99%
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“…However, when preparing dense or mesoporous films above 1 μm in thickness by a single coating step, using nanoparticle dispersions or sol−gel precursor solutions, the films are prone to crack during the firing step. 34 The cracking originates most prominently from the in-plane tensile stress development during the annealing, referred to as the intrinsic in-plane stress, which includes solvent evaporation and densification processes shrinking the films to 70% of their initial thickness. 35 During the cooling procedure to room temperature, the difference in the thermal expansion coefficients between the substrate and the film either raises or lowers the in-plane stress observed at room temperature labeled as the residual in-plane stress.…”
Section: ■ Introductionmentioning
confidence: 99%
“…35 During the cooling procedure to room temperature, the difference in the thermal expansion coefficients between the substrate and the film either raises or lowers the in-plane stress observed at room temperature labeled as the residual in-plane stress. 34 For the successful preparation of thicker films without repetitive deposition, the in-plane stress must be kept low, which can be obtained by introducing additives, for example, polymers or chelating agents to the precursor solutions. 36 In a previous study, we were able to demonstrate the inplane stress development of sol−gel-derived mesoporous titania and ceria-zirconia thin films revealing the impact of the used structure-directing agent and different sol−gel precursors such as metal alkoxides and chlorides on the inplane stress during the heat treatment until 500 °C.…”
Section: ■ Introductionmentioning
confidence: 99%
“…The residual strain in sol-gel films depends on the processing parameters, and in general, as shown in Fig. 6.6, the uniaxial shrinkage in the direction perpendicular to the substrate produces tensile stress in the film and compressive stress in the substrate [8,9]. The presence of the organic template does not reduce the stresses generated during the shrinkage of supported films, and the formation of linear dislocations is favoured because it helps to release the induced strain.…”
Section: Dislocationsmentioning
confidence: 99%
“…The growth of twin mesophases is favoured when self-assembly occurs in a film which has a limited A, B, and C) on the left side denote the packing sequence of the {111} planes. Reproduced with permission from [9] thickness and restricts the growth along the vertical direction to the substrate. Preferentially the domains grow parallel to the surface and when they meet they create an interface because the energy at the interface is minimized by the formation of a twin because a twin boundary is a low energy interface.…”
Section: Planar Defects "Polycrystalline-monocrystalline" Mesostructuresmentioning
confidence: 99%
“…Although MTMS and DMDMS have been reported to eliminate cracking in the polymers, cracking was observed in some of the OSX polymers prepared. It is thought that the stress put upon the polymer as it equilibrates from the high reaction temperature to room temperature may account for the cracks [ 32 ]. To reduce the possibility of cracks forming in the polymers, the temperature was decreased to 25 °C (room temperature).…”
Section: 1 Preparation Of Organosiloxane (Osx) Polymersmentioning
confidence: 99%