Stress Evolution During Nanoindentation in Open TSVs

Papaleo, Santo; Zisser, W. H.; Singulani, Anderson; Ceric, H.; Selberherr, S.

doi:10.1109/tdmr.2016.2622727

Cited by 1 publication

(1 citation statement)

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“…The indented displacement and force data are continuously measured, which allows the mechanical properties to be directly extracted from the loaddisplacement curves based on Oliver-Pharr theory [6][7]. Mechanical properties of coating deposited over a surface treatment that changes the original material surfaces properties on nano-to micro-scale depth can be better characterized by instrumented indentation testing method because of its simple preparation and automation [8][9][10]. Moreover, Correlative in-situ analysis with high-resolution SEM, instrumented indentation test can be real-time observation, which allows for visualization and detection of correlation of events that accompany coating deformation (such as cracking, delamination and microstructural changes) with the corresponding features in the force-displacement curve [11][12].…”

Section: Introductionmentioning

confidence: 99%

A Miniature Piezoresistive Transducer and a New Temperature Compensation Method for New Developed SEM-Based Nanoindentation Instrument Integrated With AFM Function

Zhu

Pan

et al. 2020

IEEE Access

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Instrumented indentation test inside SEM has become a versatile method for nanomechanical characterization and studying of deformation and failure mechanisms of coating materials at nano-to microscale thickness. However, the existing SEM-based nanoindentation instrument cannot acquire surface roughness of coating materials at nano-to micro-scale thickness before nanoindentation and the morphology of residual imprints in real-time inside SEM after nanoindentation. To overcome those two limitations, a new SEM-based nanoindentation instrument integrated with AFM function has been developed. This paper presents a miniature piezoresistive transducer capable of measuring force up to ±2.5N with a resolution of 0.5μN, and measuring displacement up to ±36μm with a resolution of 0.01nm for new developed SEMbased nanoindentation instrument. The transducer design, optimization, readout electronics and characterization are described. Cross-shape compliant mechanism is adopted considering the influence of the lateral force during nanoindentation process. Moreover, four piezoresistive bar-type semiconductor strain gauges (SCSG) have been glued on the cross-shape compliant mechanism enabling the transducer has a compact structure. A new temperature compensation method for SCSG sensors is proposed and solves the problem of amplifier saturation compared with traditional temperature compensation method. Compared with the existing widely used capacitive-based transducer for instrumented indentation test inside SEM, cross-shape piezoresistive transducer shows larger measured ranges. Compared with the existing piezoresistive-based transducer for instrumented indentation test inside SEM, cross-shape piezoresistive transducer shows better resolutions. In the end, the validation test of AFM imaging inside HITACHI SU5000 using standard AFM calibration chip SiC/0.75 is tested. INDEX TERMSSEM-based instrument indentation test, piezoresistive transducer, temperature compensation, SEM, AFM.

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