Stress Evolution in Electrodeposited Copper Metallization during Room-Temperature Aging

Chowdhury, Tamjid; Ahmed, Shafaat; Buckley, D. H.; Laugier, M. T.; Nakahara, S.; Heffernan, Colm

doi:10.1149/1.2218481

Cited by 3 publications

(1 citation statement)

References 9 publications

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“…Thin metal films deposited on a substrate are usually in a state of stress and this has been the subject of extensive experimental investigation and theoretical analysis . Various studies [1][2][3][4][5][18][19][20][21][22]27,28 of the stress generated during the electrodeposition and aging of copper films have been reported. Haiss et al 4 investigated the dependence of stress on overpotential for copper electrodeposition on Au(111) and examined the stress evolution during the first 25 monolayers of deposition.…”

Section: Introductionmentioning

confidence: 99%

Stress and Microstructure in Electrodeposited Copper Nanofilms by Substrate Curvature and In-situ Electrochemical AFM Measurements

Ahmed¹,

Ahmed²,

Grady³

et al. 2008

ECS Trans.

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Both AFM imaging and stress measurements were carried out in-situ during potentiostatic electrodeposition of copper on gold in 0.05 mol dm-3 CuSO4 in 0.1 mol dm-3 H2SO4. In the absence of additives, compressive stress generally developed initially and films subsequently underwent a compressive-to-tensile (C-T) transition. The nucleation density measured by AFM increased from 2.7x107 cm-2 at -75 mV to 2.5x109 cm-2 at -300 mV. Very little coalescence of nuclei was observed at -75 mV but the rate of coalescence increased rapidly with increasing negative potential. The time for the C-T transition correspondingly decreased rapidly until, at -75 mV, none was observed. This is consistent with models that attribute the C-T transition to increasing tensile stress due to coalescence of nuclei. With a combination of Cl-, PEG and MPSA, compressive stress generally developed initially and was greater than in additive-free electrolyte. At less negative potentials, the stress continued to evolve in the compressive direction, even though the rate of coalescence of nuclei was rapid. At intermediate potentials (-90 mV to -150 mV), classical C-T-C behavior was observed; at more negative potentials the stress continued to evolve in the tensile direction. This enhancement of a compressive component of stress is attributed to incorporation of additive-derived impurities.

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Section: Introductionmentioning

confidence: 99%

Stress and Microstructure in Electrodeposited Copper Nanofilms by Substrate Curvature and In-situ Electrochemical AFM Measurements

Ahmed¹,

Ahmed²,

Grady³

et al. 2008

ECS Trans.

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Electrodeposition of rhenium with suppressed hydrogen evolution from water-in-salt electrolyte

Huang

Lyons

2018

Electrochemistry Communications

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Investigation of stress and morphology in electrodeposited copper nanofilms by cantilever beam method and in situ electrochemical atomic force microscopy

Ahmed

O'Grady

et al. 2008

Journal of Applied Physics

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Both stress and atomic force microscopy (AFM) measurements were carried out in situ during potentiostatic electrodeposition of copper on gold in 0.05moldm−3 CuSO4 in 0.1moldm−3 H2SO4 with and without additives. With no additives, compressive stress generally developed initially and films subsequently underwent a compressive-to-tensile (C-T) transition. With increasing negative potential, the time for the C-T transition decreased rapidly as the rate of coalescence of nuclei (measured by AFM) increased rapidly. This is consistent with models that attribute the C-T transition to increasing tensile stress due to coalescence of nuclei. Furthermore, at a potential of −75mV (Cu∕Cu2+), where AFM showed very little coalescence of nuclei, no C-T transition was observed, again consistent with these models. The nucleation density measured by AFM increased from 2.7×107cm−2 at −75mVto2.5×109cm−2 at −300mV. Stress measurements with a combination of three additives [1×10−3moldm−3 Cl−, 8.82×10−5moldm−3 polyethylene glycol, and 1×10−5moldm−3 3-mercapto-1-propanesulfonic acid sodium salt (MPSA)] also showed that compressive stress generally developed initially and its magnitude was greater than in additive-free electrolyte. At less negative potentials, even though the rate of coalescence of nuclei was rapid, as observed by AFM, the stress continued to evolve in the compressive direction. At intermediate potentials (−90to−150mV), classical compressive-tensile-compressive (C-T-C) behavior was observed, while at more negative potentials the stress continued to evolve in the tensile direction. Similar results were obtained with a combination of two additives (1×10−3moldm−3 Cl− and 1×10−5moldm−3 MPSA), but in that case the compressive stress appeared to be greater, and consequently the T-C transition was observed even at −500mV. The results are consistent with enhancement of a compressive component of stress in the presence of additives.

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Stress Evolution in Electrodeposited Copper Metallization during Room-Temperature Aging

Cited by 3 publications

References 9 publications

Stress and Microstructure in Electrodeposited Copper Nanofilms by Substrate Curvature and In-situ Electrochemical AFM Measurements

Stress and Microstructure in Electrodeposited Copper Nanofilms by Substrate Curvature and In-situ Electrochemical AFM Measurements

Electrodeposition of rhenium with suppressed hydrogen evolution from water-in-salt electrolyte

Investigation of stress and morphology in electrodeposited copper nanofilms by cantilever beam method and in situ electrochemical atomic force microscopy

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