Stress field modeling of single-abrasive scratching of BK7 glass for surface integrity evaluation

Hu, Wenjing; Teng, Qi; Hong, Tao; Saetang, Viboon; Qi, Huan

doi:10.1016/j.ceramint.2022.01.153

Cited by 24 publications

(9 citation statements)

References 26 publications

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“…The principle is to use viscoelastic material with non-Newtonian fluid properties to prepare a specific shear pad in order to enhance the control of abrasive particles and improve the stress evenness and contact pressure on the workpiece surface based on the shear dilatancy and solidification effects under high-pressure and high-speed conditions to finally achieve high-efficiency and high-quality polishing. The scratching effect of abrasives on the workpiece is the key to achieving material removal [ 20 , 21 ]. Compared with conventional polishing pads, the dilatancy pad can hold more abrasives.…”

Section: Introductionmentioning

confidence: 99%

Effects of pH Values and H2O2 Concentrations on the Chemical Enhanced Shear Dilatancy Polishing of Tungsten

Wang

Chen

et al. 2022

Micromachines

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In order to obtain tungsten with great surface qualities and high polishing efficiency, a novel method of chemical enhanced shear dilatancy polishing (C-SDP) was proposed. The effects of pH values and H2O2 concentrations on the polishing performance of tungsten C-SDP were studied. In addition, the corrosion behaviors of tungsten in solutions with different pH values and H2O2 concentrations were analyzed by electrochemical experiments, and the valence states of elements on the tungsten surface were analyzed by XPS. The results showed that both pH values and H2O2 concentrations had significant effects on tungsten C-SDP. With the pH values increasing from 7 to 12, the MRR increased from 6.69 µm/h to 13.67 µm/h. The optimal surface quality was obtained at pH = 9, the surface roughness (Ra) reached 2.35 nm, and the corresponding MRR was 9.71 µm/h. The MRR increased from 9.71 µm/h to 34.95 µm/h with the H2O2 concentrations increasing from 0 to 2 vol.%. When the concentration of H2O2 was 1 vol.%, the Ra of tungsten reached the lowest value, which was 1.87 nm, and the MRR was 26.46 µm/h. This reveals that C-SDP technology is a novel ultra-precision machining method that can achieve great surface qualities and polishing efficiency of tungsten.

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Section: Introductionmentioning

confidence: 99%

Effects of pH Values and H2O2 Concentrations on the Chemical Enhanced Shear Dilatancy Polishing of Tungsten

Wang

Chen

et al. 2022

Micromachines

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“…The distribution of residual stress in shot peening of 12Cr2Ni4A steel was investigated by Zhao et al [ 11 ] in order to optimize the processing parameters, and a numerical stimulation using the Computational Fluid Dynamics and Finite Element Model was also conducted in order to study the influence of processing parameters on the induced compressive residual stress and its strengthening mechanism [ 14 ]. Residual stress is one of the most important factors affecting machining performance in the advanced manufacturing process [ 15 , 16 ], and should be considered in the shot peening process as well.…”

Section: Introductionmentioning

confidence: 99%

Strengthening Performance Optimization of Single Ball Impact Treatment by Evaluating Residual Stress

Yang

Wang

2022

Materials

Self Cite

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Residual stress plays an essential role in affecting the strengthening performance by a surface treatment. Studying the impact of a single ball on a target surface is the basis of shot peening technology in order to obtain the distribution of the residual stress, and to optimize the processing parameters. In this paper, a numerical model has been developed to represent single ball impacts on high manganese steel by considering different processing parameters. It was found that by increasing the ball diameter and impact velocity, the depth of maximum residual compressive stress and the depth of the residual compressive stress layer became significantly enlarged due to increasing kinetic energy of the impacting ball. It was also found from simulation that with an increase in ball impact angle, the maximum residual compressive stress, the depth of maximum residual compressive stress and the depth of the residual compressive stress layer were significantly improved; an exception was the surface residual compressive stress, which showed a decreasing trend. Moreover, by employing quantitative analysis with the entropy method, it was found that within the range of processing parameters considered in the simulation, it is recommended to use a ball with a diameter of 0.6 mm to impact the target, with a velocity of 80 m/s and an angle of 90° for the best strengthening performance.

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“…Currently, the flat substrates of hard brittle materials, like RB-SiC ceramics, are usually prepared by using the abrasive lapping and polishing processes [8,9], and to ensure the machining efficiency and quality, the optimization of processing parameters is necessary by conducting and repeating associated experiments many times, which is to some extent time-consuming and expensive. The single abrasive scratching test is considered one of the effective ways to investigate the fundamental of material removal mechanisms and provides good references for the abrasive machining process [10][11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Surface Morphology Evaluation and Material Removal Mechanism Analysis by Single Abrasive Scratching of RB-SiC Ceramics

You

Yuan

et al. 2022

Crystals

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Reaction-Bonded Silicon Carbide (RB-SiC) ceramics possessing excellent mechanical and chemical properties, whose surface integrities have an essential effect on their performance and service life, have been widely used as substrates in the core parts of aerospace, optics and semiconductors industries. The single abrasive scratching test is considered as the effective way to provide the fundamental material removal mechanisms in the abrasive lapping and polishing of RB-SiC ceramics for the best surface finish. In this study, a novel single abrasive scratching test with an increasing scratching depth has been properly designed to represent the real abrasive lapping and polishing process and employed to experimentally investigate the surface integrity regarding different scratching speeds. Three typical and different material removal stages, including the ductile mode, ductile–brittle transition mode and brittle mode, can be clearly distinguished and it is found that in the ductile material removal stage by increasing the scratching speed would inhibit the plastic deformation and improve its surface integrity. It is also found that in the ductile–brittle transition and brittle material removal stages, to increase the scratching speed would inhibit the plastic deformation due to the fast scratching speed that limits the time of plastic deformation on the target, but it also results in the increased length of lateral cracks with the increased scratching speed which can reflect that the size of brittle chips, like brittle fractures and large grain fragmentations, increases as the scratching speed increases. It can provide the references for the optimization of the abrasive lapping and polishing of RB-SiC ceramics with high efficiency and surface quality.

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Stress field modeling of single-abrasive scratching of BK7 glass for surface integrity evaluation

Cited by 24 publications

References 26 publications

Effects of pH Values and H2O2 Concentrations on the Chemical Enhanced Shear Dilatancy Polishing of Tungsten

Effects of pH Values and H2O2 Concentrations on the Chemical Enhanced Shear Dilatancy Polishing of Tungsten

Strengthening Performance Optimization of Single Ball Impact Treatment by Evaluating Residual Stress

Surface Morphology Evaluation and Material Removal Mechanism Analysis by Single Abrasive Scratching of RB-SiC Ceramics

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