1992
DOI: 10.1007/bf02684208
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Stress in thermally annealed parylene films

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Cited by 48 publications
(32 citation statements)
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“…1(c)]. This is followed by a parylene-C deposition with a thickness of [10][11][12][13][14][15][16][17][18][19][20] to refill the trenches [see Fig Clearly, the parylene-C deposition is conformal, and the film thickness is almost uniform even inside the deep trench. This is because the mean free path of parylene molecules is as small as a few cm, and also because the sticking coefficient, which is defined by the ratio between the number of molecules reacting with a radical chain end and the number of incident monomer molecules onto the surface, is as low as at room temperature [28].…”
Section: Fabrication Of Parylene High-aspect-ratio Structuresmentioning
confidence: 99%
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“…1(c)]. This is followed by a parylene-C deposition with a thickness of [10][11][12][13][14][15][16][17][18][19][20] to refill the trenches [see Fig Clearly, the parylene-C deposition is conformal, and the film thickness is almost uniform even inside the deep trench. This is because the mean free path of parylene molecules is as small as a few cm, and also because the sticking coefficient, which is defined by the ratio between the number of molecules reacting with a radical chain end and the number of incident monomer molecules onto the surface, is as low as at room temperature [28].…”
Section: Fabrication Of Parylene High-aspect-ratio Structuresmentioning
confidence: 99%
“…and 350 in height due to the RIE lag. Parylene film is known to be in compressive stress as it is deposited, but that becomes tensile stress after thermal annealing [13], [14]. In the present study, the parylene film undergoes baking at 100-110 for the lithography step of the etch windows on the backside [see Fig.…”
Section: Fabrication Of Parylene High-aspect-ratio Structuresmentioning
confidence: 99%
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“…Depositing metal on only one side of the Parylene would also make the device prone to curling due to residual stresses in the various layers, which have been measured as 22 MPa (Dabral et al, 1992;Harder et al, 2002), 230 MPa (Branger et al, 1996), and 383 MPa (Tripp et al, 2006), for Parylene, platinum, and Al2O3, respectively. Curling was not observed on our devices because the sandwich structure caused the residual stress in the two layers to cancel out (Branger et al, 1996).…”
Section: Minimum Bending Diametermentioning
confidence: 99%
“…The check valve is thermally annealed at predetermined temperature after the sacrificial photoresist is released and quenched down afterwards. Since the residual tensile stress of the thermally annealed parylene C can be as high as 34 MPa at 250°C [5], this approach allows the parylene tethers to provide a high downward force while it does not require any post-fabrication fixation. …”
Section: Introductionmentioning
confidence: 99%