1991
DOI: 10.1299/kikaia.57.59
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Stress intensity factors of a small crack near the transient partial heat source.

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“…In particular, the fracture behavior in the vicinity of a crack tip at high and low temperatures must be studied in detail since materials are often subject to fracture by thermal stresses. In the past, attempts have been made to theoretically analyze the thermal stress intensity factor (SIF) (Matsunaga, et al, 1989;Goshima, et al, 1991). On the other hand, numerous papers have been published on experimental approaches to these problems using the photoelastic method (Zhang and Burger, 1985;Matsumoto, et al, 1990) and the caustic method (Wang and Hwang, 1994;Wang and Chen, 1993;Aoki, et al, 1994).…”
Section: Introductionmentioning
confidence: 99%
“…In particular, the fracture behavior in the vicinity of a crack tip at high and low temperatures must be studied in detail since materials are often subject to fracture by thermal stresses. In the past, attempts have been made to theoretically analyze the thermal stress intensity factor (SIF) (Matsunaga, et al, 1989;Goshima, et al, 1991). On the other hand, numerous papers have been published on experimental approaches to these problems using the photoelastic method (Zhang and Burger, 1985;Matsumoto, et al, 1990) and the caustic method (Wang and Hwang, 1994;Wang and Chen, 1993;Aoki, et al, 1994).…”
Section: Introductionmentioning
confidence: 99%