This paper presents a comprehensive study of the resistance of solder joints to failure when subjected to strain rates that simulate the conditions of drop impact experienced by a portable electronic product. Two test methods are used in this study: the board-level drop-shock test (BLDST) and the boardlevel high-speed cyclic bend test (HSCBT). The performance of (i) 12 material combinations consisting of six solder alloys and two pad finishes, and (ii) 11 manufacturing variations covering three vendors, two finishes, three immersion gold thicknesses, and three thermal aging conditions were investigated using these two test methods. Correlations between the two test methods were performed. Quantitative correlation and sensitivity coefficients for the failure modes and the measured characteristic parameters-number of drops to failure for BLDST and number of cycles to failure for HSCBT-were evaluated. Finally, the potential of HSCBT as a test method for material selection and for bridging board-level and product-level tests was demonstrated through generation of board strain versus number of cycles to failure (S-N) curves of solder joints for six material systems, four bending frequencies, and two test temperatures.