2021
DOI: 10.1016/j.matchemphys.2020.124170
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Striking a balance: Role of supramolecular assemblies on the modulation of the chemical and mechanical contributions during Post-STI CMP cleaning

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Cited by 9 publications
(7 citation statements)
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“…In all of our experiments, we used the Araca, Inc. PCC-300 ® single-sided PVA brush scrubber and tribometer. 1,2 The main body of the cleaning module is a fully-automated robotic assembly consisting of a wafer carrier component (mainly based on a modified Struers LaboPol-30 system 3 ) and a brush cleaner component. The wafer carrier holds and acts as a rotating platform for a 300-mm blanket or patterned wafer.…”
Section: Experimental Apparatus and Conditionsmentioning
confidence: 99%
“…In all of our experiments, we used the Araca, Inc. PCC-300 ® single-sided PVA brush scrubber and tribometer. 1,2 The main body of the cleaning module is a fully-automated robotic assembly consisting of a wafer carrier component (mainly based on a modified Struers LaboPol-30 system 3 ) and a brush cleaner component. The wafer carrier holds and acts as a rotating platform for a 300-mm blanket or patterned wafer.…”
Section: Experimental Apparatus and Conditionsmentioning
confidence: 99%
“…Previous work has shown that the shape and charge of the supramolecular structure play a crucial role in effective CeO 2 nanoparticle removal. 19 21 More specifically, upon delivery to the wafer surface, micelles recover at a slower rate than polyelectrolytes. Though these additives do reduce the overall shear force and help to minimize defectivity induced during the cleaning process, it is not perfect and can cause p-CMP defects from the contact modality.…”
Section: Introductionmentioning
confidence: 99%
“…While this has shown to be an effective mode of particle removal, there is an increase in the process shear force (mechanical component), which results in secondary defect formation (i.e., increased scratching/surface roughness). , More recently attention has shifted to developing p-CMP cleaning formulations that employ encapsulation of the CeO 2 nanoparticle using supramolecular chemistries (i.e., surfactants, polyelectrolytes, liposomes, etc.). Previous work has shown that the shape and charge of the supramolecular structure play a crucial role in effective CeO 2 nanoparticle removal. More specifically, upon delivery to the wafer surface, micelles recover at a slower rate than polyelectrolytes. Though these additives do reduce the overall shear force and help to minimize defectivity induced during the cleaning process, it is not perfect and can cause p-CMP defects from the contact modality.…”
Section: Introductionmentioning
confidence: 99%
“…25 The "soft" cleaning chemistries strike a delicate balance between the need for charge-flipping and the control of aggregates formed at the brush-wafer interface, clearly reducing wafer-level defects, and controlling the surface passivation mechanisms. 26 The specific driving force behind our study.-What precipitated this fundamental study was our access to a series of marathon runs performed at IBM's 14-nm node manufacturing line where a total of 2,600 specially-prepared 300-mm particle monitor wafers having 2,000 Angstroms of PETEOS-based silicon dioxide film deposited on them were polished and cleaned in HVM copper CMP and postcleaning processes, and their surfaces analyzed to determine the net number of added wafer-level defects (NADD).…”
mentioning
confidence: 99%
“…1, and described in detail elsewhere. 27,28 The main body of the cleaning module is a fully automated robotic assembly consisting of a wafer carrier component (mainly based on a modified Struers Labopol-30 system) 29 and a brush cleaner component. The wafer carrier holds and acts as a rotating platform for a 300-mm blanket or patterned wafer.…”
mentioning
confidence: 99%