Strong adhesion of polyvinylpyrrolidone-coated copper nanoparticles on various substrates fabricated from well-dispersed copper nanoparticle inks

Yokoyama, S.; Nozaki, Junpei; Motomiya, Kenichi; Tsukahara, Norihito; Takahashi, Hideyuki

doi:10.1016/j.colsurfa.2020.124567

Cited by 19 publications

(14 citation statements)

References 35 publications

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“…Afterward 200 µl of the ink was drop cast on a PVP-coated glass substrate. PVP acts as an adhesive between the FeRh nanoparticles and the substrate and it also assists the particle consolidation during the sintering process 61 . The obtained film was then sintered using a continuous wave (CW)-laser (Laser Quantum, 532 nm) and a 2-axis linear stage (Thorlabs DDSM100/M).…”

Section: Methodsmentioning

confidence: 99%

Towards laser printing of magnetocaloric structures by inducing a magnetic phase transition in iron-rhodium nanoparticles

Nadarajah

Landers

Salamon

et al. 2021

Sci Rep

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The development of magnetocaloric materials represents an approach to enable efficient and environmentally friendly refrigeration. It is envisioned as a key technology to reduce CO2 emissions of air conditioning and cooling systems. Fe-Rh has been shown to be one of the best-suited materials in terms of heat exchange per material volume. However, the Fe-Rh magnetocaloric response depends on its composition. Hence, the adaptation of material processing routes that preserve the Fe-Rh magnetocaloric response in the generated structures is a fundamental step towards the industrial development of this cooling technology. To address this challenge, the temperature-dependent properties of laser synthesized Fe-Rh nanoparticles and the laser printing of Fe-Rh nanoparticle inks are studied to generate 2D magnetocaloric structures that are potentially interesting for applications such as waste heat management of compact electrical appliances or thermal diodes, switches, and printable magnetocaloric media. The magnetization and temperature dependence of the ink’s γ-FeRh to B2-FeRh magnetic transition is analyzed throughout the complete process, finding a linear increase of the magnetization M (0.8 T, 300 K) up to 96 Am2/kg with ca. 90% of the γ-FeRh being transformed permanently into the B2-phase. In 2D structures, magnetization values of M (0.8 T, 300 K) ≈ 11 Am2/kg could be reached by laser sintering, yielding partial conversion to the B2-phase equivalent to long-time heating temperature of app. 600 K, via this treatment. Thus, the proposed procedure constitutes a robust route to achieve the generation of magnetocaloric structures.

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Section: Methodsmentioning

confidence: 99%

Towards laser printing of magnetocaloric structures by inducing a magnetic phase transition in iron-rhodium nanoparticles

Nadarajah

Landers

Salamon

et al. 2021

Sci Rep

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“…The electrical conductivity increases from 1 × 10 3 to 8 × 10 3 S/m, an 8-fold increase, by increasing the HPMC solution content from 2 to 50 wt % in the copper ink. The increased conductivity is a result of an improved adhesion and dispersibility of Cu in the preparation of the printable ink materials . The electrical conductivity improved most significantly from 10 to 20 wt % HPMC in the printable Cu materials (from 2 × 10 3 to 6 × 10 3 S/m), while any further increase in HPMC above 20 wt % shows minor increments in the conductivity.…”

Section: Results and Discussionmentioning

confidence: 98%

“…The printability of the conductive inks is also of great importance. Cu NPs have the best printability due to smaller sizes but can have potential issues with agglomeration of the NPs, which can result in fragile prints . In addition to these, Cu NWs tend to suffer from clogging of the nozzles due to the large aspect ratio, thus limiting the available printing techniques. ,, Cu NPLs, due to the 2D architecture, do not suffer from nozzle clogging as much from the larger aspect ratio but are limited to the size of the basal plane (similar to the diameter of Cu NPs).…”

Section: Introductionmentioning

confidence: 99%

Copper Nanoplates for Printing Flexible High-Temperature Conductors

Sheng

Khuje

et al. 2022

ACS Appl. Nano Mater.

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Copper has attracted immense interest in advanced electronics attributed to its abundance and high electrical and thermal characteristics. However, the ease of oxidation when subjected to heat and humidity drastically limits its material reliability under extreme environments. Here, we utilize copper nanoplates as a building block to achieve a thermally stable (upwards of 1300 °C), antioxidation, and anticorrosion-printed conductor, with the capability of additively manufacturing on Corning flexible Alumina Ribbon Ceramic. We elucidate the printed copper nanoplates with a low sheet resistance of 4 mΩ/sq/mil by means of a surfacecoordinated formate that inculcates high oxidation and corrosion resistance on a molecular level. In addition, an in situ copper− graphene conversion leads to a hybridized conductor displaying stability at elevated temperatures up to 1300 °C with high ampacity. Further mechanistic studies reveal high-temperature stability from in situ graphene conversion for copper and graphene interfaces, and preferential stacking of copper nanoplates, distinctly suited for emerging high-temperature flexible electronics.

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“…Furthermore, the high molecular weight of the polymer also helps the copper ink adhere to the flexible substrate [ 52 ]. PVP, because of its unique lactam structure, has both hydrophilic and lipophilic properties and can thus form a film with strong binding force on plastic [ 52 , 53 ]. Furthermore, PVP is also often used as a surface dispersant that prevents ink from precipitating [ 35 , 54 ].…”

Section: Resultsmentioning

confidence: 99%

Preparing Copper Nanoparticles and Flexible Copper Conductive Sheets

et al. 2022

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Nanotechnology is used in a wide range of fields, including medicine, cosmetics, and new material development, and is one of the most popular technologies in the field of flexible electronic products. For the present work, the chemical reduction method with environmentally friendly reducing agents was used to synthesize copper nanoparticles (CuNPs) with good dispersibility. The CuNPs were characterized by transmission electron microscopy (TEM), X-ray diffraction (XRD), and ultraviolet–visible spectrophotometry (UV–vis). After the CuNPs were formed, the solvent, polymers, and additives were added to form copper ink. Finally, the prepared copper inks were applied to flexible polyethylene terephthalate (PET) substrate under low sintering temperature and the effects of sintering time and different concentrations of sintering agent on resistivity were investigated. The results show that the copper nanoparticles synthesized by secondary reduction were smaller, more uniform, and better dispersed than those formed by primary reduction. Ethylene glycol has reducing effects under high temperatures; therefore, the CuNPs formed using the mixed solvent were small and well dispersed. The copper ink was applied on the PET substrate, treated with a formic acid aqueous solution, and sintered at 130 °C for 60 min, and its resistivity was about 1.67 × 10−3 Ω cm. The proposed synthesizing method is expected to have potential applications in the flexible electronic products field.

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Strong adhesion of polyvinylpyrrolidone-coated copper nanoparticles on various substrates fabricated from well-dispersed copper nanoparticle inks

Cited by 19 publications

References 35 publications

Towards laser printing of magnetocaloric structures by inducing a magnetic phase transition in iron-rhodium nanoparticles

Towards laser printing of magnetocaloric structures by inducing a magnetic phase transition in iron-rhodium nanoparticles

Copper Nanoplates for Printing Flexible High-Temperature Conductors

Preparing Copper Nanoparticles and Flexible Copper Conductive Sheets

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