2015
DOI: 10.1038/srep17314
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Strong Geometrical Effects in Submillimeter Selective Area Growth and Light Extraction of GaN Light Emitting Diodes on Sapphire

Abstract: Advanced semiconductor devices often utilize structural and geometrical effects to tailor their characteristics and improve their performance. We report here detailed understanding of such geometrical effects in the epitaxial selective area growth of GaN on sapphire substrates and utilize them to enhance light extraction from GaN light emitting diodes. Systematic size and spacing effects were performed side-by-side on a single 2” sapphire substrate to minimize experimental sampling errors for a set of 144 patt… Show more

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Cited by 39 publications
(36 citation statements)
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“…For t g ¼ 45 min, the CrO 2 islands exhibit fully developed facets with smooth surfaces. This type of facet evolution with growth time has been reported recently for SAG of GaN [27]. In addition to the formation of crystalline facets, the extent of lateral overgrowth naturally determines the effective dimensions of the CrO 2 structures.…”
Section: Introductionsupporting
confidence: 66%
“…For t g ¼ 45 min, the CrO 2 islands exhibit fully developed facets with smooth surfaces. This type of facet evolution with growth time has been reported recently for SAG of GaN [27]. In addition to the formation of crystalline facets, the extent of lateral overgrowth naturally determines the effective dimensions of the CrO 2 structures.…”
Section: Introductionsupporting
confidence: 66%
“…In order to eliminate cracking in the Si substrate, we hypothesized that a free Si surface will also dilate the stresses in Si upon cooling down from the GaN growth temperature as supported by thermal stress simulations in Figure d. Therefore, we estimated the lateral overgrowth based on our earlier SAG studies and fabricated structures for which the exposed 500 nm‐thick GaN seed layer is surrounded by an SiO 2 growth mask on top of an isotropically etched Si structure (Figure e and the Experimental Section). This free surface structure (Figure e) resulted in crack‐free GaN layers and Si substrate because the free surface of the Si substrate can accommodate the stress by rotation.…”
mentioning
confidence: 99%
“…14(a), four different mask geometries with dimensions (windows size, mask size) defined as (2 μm, 4 μm), (4 μm, 2 μm), (5 μm, 5 μm), (3 μm, 7 μm), which were denoted as A, B, C, and D, respectively. After the regrowth of GaN and InGaN/GaN MQWs by MOCVD, the morphologies strongly depended on the mask geometry [80]. It can be seen from Fig.…”
Section: Accepted Manuscriptmentioning
confidence: 94%