Sintering Applications 2013
DOI: 10.5772/54037
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Structural and Dielectric Properties of Glass – Ceramic Substrate with Varied Sintering Temperatures

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Cited by 12 publications
(13 citation statements)
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References 88 publications
(89 reference statements)
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“…As a result, a marginal decrease in dielectric loss with a slight increase in dielectric constant are observed20. After firing, the improvement in dielectric constant and a remarkable decrease in dielectric loss are mainly due to the densification of sintered tape which occurs by the combined effect of burnout of organic additives, removal of pores, microstructural grain growth and the strong bonding of ceramic particles during sintering53. The sintered ZAT tape shows good microwave dielectric properties with ε r of 9.6 and tan δ of 8.4 × 10 -4 at 5 GHz.…”
Section: Resultsmentioning
confidence: 99%
“…As a result, a marginal decrease in dielectric loss with a slight increase in dielectric constant are observed20. After firing, the improvement in dielectric constant and a remarkable decrease in dielectric loss are mainly due to the densification of sintered tape which occurs by the combined effect of burnout of organic additives, removal of pores, microstructural grain growth and the strong bonding of ceramic particles during sintering53. The sintered ZAT tape shows good microwave dielectric properties with ε r of 9.6 and tan δ of 8.4 × 10 -4 at 5 GHz.…”
Section: Resultsmentioning
confidence: 99%
“…First, according to value of shrinkage in x- and y- axes, it is necessary to enlarge all dimensions of designed device, and second, according to value of shrinkage in z- axis, it is necessary to know exact thickness of substrate after sintering in case for matching device to 50 Ω characteristic impedance (microstrip, stripline, etc.). Consistency and repeatability of shrinkage rate must be the top criteria when designing any LTCC device (Alias, 2013). Shrinkage rate of used LTCC substrates is shown in Table II.…”
Section: Low Temperature Co-fired Ceramic Substratesmentioning
confidence: 99%
“…vibrations, thermal stress, mechanical stress etc. [2]. These properties were the reason why we have decided to analyze stability of LTCC substrates in HF area after accelerated aging tests.…”
Section: Introductionmentioning
confidence: 98%
“…Sintering has significant impact on microstructure and related dielectric properties [2]. During sintering process phases of glass in substrates are changing and their ratio in combination with another factors (size of grains, porosity, etc.)…”
Section: Introductionmentioning
confidence: 99%