Structural and Electrochemical Properties of Chemically Deposited Copper Doped Nickel Hydroxide

Abstract

Present work reported, copper doped Ni(OH) deposited successfully by chemical bath deposition method on 2 economical stainless steel electrode. The XRD analysis represent hexagonal crystal structure and presence of Ni and Cu confirm by FT-IR study. The surface morphology studied by SEM indicates nanopetals linked marigold like microflowers. -1 -1 The 0.2% Cu doped Ni(OH)2 shows specific capacitance 715 Fg at scan rate 10 mV s . EIS study interprets that electrode N-0.2% have least charge transfer resistance which improve value of specific capacitance. All results revels cupper is good dopant for improve the specific capacitance.