2016
DOI: 10.1016/j.pisc.2016.06.042
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Structural and mechanical study of thermally annealed tungsten nitride thin films

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Cited by 17 publications
(9 citation statements)
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“…A DC power supply was applied to sputter W target, and a RF power supply was applied to sputter the Si target. Before deposition, Si substrates were cleaned to remove contaminants from the substrate surface using the standard method, as reported in our previous publication 10,16 . Other deposition parameters are given in Table 1.…”
Section: Methodsmentioning
confidence: 99%
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“…A DC power supply was applied to sputter W target, and a RF power supply was applied to sputter the Si target. Before deposition, Si substrates were cleaned to remove contaminants from the substrate surface using the standard method, as reported in our previous publication 10,16 . Other deposition parameters are given in Table 1.…”
Section: Methodsmentioning
confidence: 99%
“…The W and Si targets were pre‐sputtered for 10 min at 10 W DC and 8 W RF power respectively to remove impurities present on the target surface with closed shutter. The depositions were performed with previously optimized flow rates of argon and nitrogen gas ratio as Ar : N 2 = 20:5 sccm, More details about the system, the process can be found in our previous work 10‐12,16 . The following two series were deposited to analyze the role of Si 3 N 4 content and substrate temperature (Table 2).…”
Section: Methodsmentioning
confidence: 99%
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“…Numerous studies have been performed on ALD grown nitrides (such as MoN x , WN x , TaN x , HfN x , etc. ), where the phase change (from amorphous to crystalline) and the decomposition of the nitride film to metal were observed after annealing [36][37][38][39][40][41]. For example, the amorphous δ-MoN films deposited by sputtering at room temperature, crystallized after annealing in vacuum at temperatures above 600 °C [36].…”
Section: Introductionmentioning
confidence: 99%