Structural and performance variations of aluminoborosilicate glass substrates with mixed alkaline earth effect for applications in 3D integrated packaging

Xie, Haohong; Chen, Hongwei; Fu, Haolun; Liang, Tianpeng; Gao, Libin; Deng, Bowen; Zhang, Jihua

doi:10.1016/j.ceramint.2024.07.171

Ceramics International

2024

DOI: 10.1016/j.ceramint.2024.07.171

|View full text |Cite

Structural and performance variations of aluminoborosilicate glass substrates with mixed alkaline earth effect for applications in 3D integrated packaging

Haohong Xie,

Hongwei Chen,

Haolun Fu

et al.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

Publication Types

Select...

Article1

Relationship

Self Cite0

Independent1

Authors

Journals

Cited by 1 publication

References 27 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films

Lu,

Lv,

Zhang

et al. 2024

Micromachines

View full text Add to dashboard Cite

Integrating nanocrystalline diamond (NCD) films on silicon chips has great practical significance and many potential applications, including high-power electronic devices, microelectromechanical systems, optoelectronic devices, and biosensors. In this study, we provide a solution for ensuring heterogeneous interface integration between silicon (Si) chips and NCD films using low-temperature bonding technology. This paper details the design and implementation of a magnetron sputtering layer on an NCD surface, as well as the materials and process for the connection layer of the integrated interface. The obtained NCD/Ti/Cu composite layer shows uniform island-like Cu nanostructures with 100~200 nm diameters, which could promote bonding between NCD and Si chips. Ultimately, a heterogeneous interface preparation of Si/Ag/Cu/Ti/NCD was achieved, with the integration temperature not exceeding 250 °C. The TEM analysis shows the closely packed atomic interface of the Cu NPs and deposited Ti/Cu layers, revealing the bonding mechanism.

show abstract

Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films

Lu,

Lv,

Zhang

et al. 2024

Micromachines

View full text Add to dashboard Cite

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Structural and performance variations of aluminoborosilicate glass substrates with mixed alkaline earth effect for applications in 3D integrated packaging

Cited by 1 publication

References 27 publications

Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films

Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films

Contact Info

Product

Resources

About