Structural and phase mechanism and rate of interaction between TiCu, Ti3Cu4, and Ti2Cu3 intermetallic compounds and hydrogen. I. Formation and decomposition of intermetallic hydrides

Kucheryavyi, O. V.; Bratanich, T. I.; Скороход, В. В.; Kopylova, L. I.; Krapivka, N. A.

doi:10.1007/s11106-012-9423-4

Cited by 4 publications

(2 citation statements)

References 8 publications

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“…For example, the use of a copper coating to create a multi-barrier system of energy "traps" on the surface of titanium hydride spheres increases their thermal stability by creating a protective shell that prevents the thermal diffusion of hydrogen into the environment. In the literature, there are many works on the creation of a copper layer, such as electrophoretic deposition [26], continuous casting [27], reactive DC magnetron sputtering [28], dip coating [29], and others [30][31][32][33][34]. The copper layer completely covers the surface of the spherical titanium hydride, covering all surface microcracks.…”

Section: Introductionmentioning

confidence: 99%

Increasing the Adherence of Metallic Copper to the Surface of Titanium Hydride

et al. 2021

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Studies have been carried out to increase the adhesive interaction between a titanium hydride substrate and a copper coating. An additional layer containing chemically active groups was created on the surface of the spherical titanium hydride by chemisorption modification. This paper discusses the results of scanning electron microscopy (SEM) using energy-dispersive X-ray spectroscopic mapping of coatings obtained on spherical granules of titanium hydride before and after adsorption modification. The mechanism of interaction of the surface of spherical granules of titanium hydride and titanium sulfate salt is proposed. It is shown that the creation of a chemisorbed layer of hydroxotitanyl and the subsequent electrodeposition of metallic copper contribute to the formation of a multilayer shell of a titanium–copper coating on the surface of spherical titanium hydride granules (≡Ti-O-Cu-) with a high adhesive interaction. Results have been given for an experimental study of the thermal stability of the initial spherical granules of titanium hydride and granules coated with a multilayer titanium-copper shell.

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Section: Introductionmentioning

confidence: 99%

Increasing the Adherence of Metallic Copper to the Surface of Titanium Hydride

et al. 2021

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“…Metal-intermetallic laminates have the potential to perform various functions, such as ballistic protection, heat exchange, blast mitigation and vibration damping 39 . The unique physical properties of intermetallic titanium-copper (TiCu), which is one kind of functional material 40 , such as extreme hardness, good sound absorption, electric conductivity etc ., make this alloy a subject of scientific and technological interest. In addition, TiCu alloys are now receiving a great deal of attention as ultra-high strength and conductive materials for applications such as conductive springs, interconnections etc 41 .…”

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confidence: 99%

A deformation mechanism of hard metal surrounded by soft metal during roll forming

Tieu

Lü

et al. 2014

Sci Rep

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It is interesting to imagine what would happen when a mixture of soft-boiled eggs and stones is deformed together. A foil made of pure Ti is stronger than that made of Cu. When a composite Cu/Ti foil deforms, the harder Ti will penetrate into the softer Cu in the convex shapes according to previously reported results. In this paper, we describe the fabrication of multilayer Cu/Ti foils by the roll bonding technique and report our observations. The experimental results lead us to propose a new deformation mechanism for a hard metal surrounded by a soft metal during rolling of a laminated foil, particularly when the thickness of hard metal foil (Ti, 25 μm) is much less than that of the soft metal foil (Cu, 300 μm). Transmission Electron Microscope (TEM) imaging results show that the hard metal penetrates into the soft metal in the form of concave protrusions. Finite element simulations of the rolling process of a Cu/Ti/Cu composite foil are described. Finally, we focus on an analysis of the deformation mechanism of Ti foils and its effects on grain refinement, and propose a grain refinement mechanism from the inside to the outside of the laminates during rolling.

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