2021
DOI: 10.1002/admt.202100746
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Structural Design and Property Study on Flexible Electronic Films with High Heat Resistance and Friction Durability

Abstract: To improve both thermal stability and friction durability of flexible electronic films with nano‐Ag, a series of flexible films with dendric nano‐Ag embedded into high thermally stable 2‐adamantane containing poly(aryl ether ketone) (2‐ADMPEK, PAEK) substrates are prepared in this work. These films are named as PAEK‐dnAg. The dendric nanostructure of Ag conductive layer performs excellent conductivity with sheet resistance as low as 0.3959 Ω ◻−1. The wide‐angle X‐ray diffraction and scanning electron microscop… Show more

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