Structural Evolution of Bulk Silver during Cold Rolling and Annealing

Ning, Zheda; Wang, Qunshou; Zhang, Dong; Pei, Wenli; Wen, Ming

doi:10.3390/met12091525

Cited by 3 publications

(2 citation statements)

References 23 publications

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“…Thus, the deposited foil adherence was increased by the coin hammering, which presses the fine grains resulting after Hg evaporation into a compact structure embedded into the copper grains of the substrate, a fact proved by the microstructural aspects observed in Figure 5a. Cold pressing of the thin silver foil is sustained by the lack of Ag-twined grains, which are indicators of tin foil recrystallization [33,34]. A clear mark of the "Kipper" element of the crisis is the hole pierced into the forged coin from 1620 that clearly reveals its copper core.…”

Section: Discussionmentioning

confidence: 99%

Ag and Sn Implications in 3-Polker Coins Forgeries Evidenced by Nondestructive Methods

Petean,

Paltinean,

Taut

et al. 2023

Materials

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Several forged 3-Polker coins have been reported in historical sources on the financial crisis that occurred between 1619 and 1623 at the start of the 30-year-long war. Supposedly, belligerent countries forged other countries’ coins which were then used for external payments as a war strategy. Thus, a lot of 3-Polker coins (e.g., Sigismund-III-type) were forged, and the markets became flooded with poor currency. In the present day, these pre-modern forgeries are rare archeological findings. Only five forged 3-Polker coins randomly found in Transylvania were available for the current study. There are deeper implications of silver and tin in the forgery techniques that need to be considered. Thus, the forged 3-Polker coins were investigated via nondestructive methods: SEM microscopy coupled with EDS elemental spectroscopy for complex microstructural characterization and XRD for phase identification. Three distinct types of forgery methods were identified: the amalgam method is the first used for copper blank silvering (1620), and immersion in melted silver (1621) is the second one. Both methods were used to forge coins with proper legends and inscriptions. The third method is the tin plating of copper coins (with corrupted legend and altered design) (1622, 1623, and 1624). The EDS investigation revealed Hg traces inside the compact silver crusts for the first type and the elongated silver crystallites in the immersion direction, which are well-attached to the copper core for the second type. The third forgery type has a rich tin plating with the superficial formation of Cu6Sn5 compound that assures a good resistance of the coating layer. Therefore, this type should have been easily recognized as fake by traders, while the first two types require proper weighing and margin clipping to ensure their quality.

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Section: Discussionmentioning

confidence: 99%

Ag and Sn Implications in 3-Polker Coins Forgeries Evidenced by Nondestructive Methods

Petean,

Paltinean,

Taut

et al. 2023

Materials

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“…This occurrence of the Ag (210) plane is due to the grain reorientation of Ag, as mentioned in previous reports. 44 the intensity of the peak denoting the (111) plane decreases. With a further increase in plasma exposure duration (450sP Si/Ag), the peak corresponding to the (210) plane diminishes, and only the (111) plane remains in the 600sP Si/Ag sample.…”

Section: B Crystallinity and Morphology 1 X-ray Diffraction (Xrd) Ana...mentioning

confidence: 96%

Silicon (100) surface passivation-driven tuning of Ag film crystallinity and its impact on the performance of Ag/n-Si mid-infrared Schottky photodetector

Sharma,

Dong,

Chiang

et al. 2024

APL Materials

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The utilization of metal/semiconductor Schottky devices for plasmonic harvesting of hot carriers holds immense potential in the field of sub-bandgap photodetection. In this work, we explore a surface passivation scheme using air plasma exposure to modify the Si (100) surface and subsequently the crystal orientation of the deposited Ag film for photon detection in the mid-infrared (MIR) regime. This tailoring was achieved by varying the plasma exposure duration (0, 150, 300, 450, and 600 s). As a result, we could tune the crystal orientation of Ag from the (200) to the (210) crystal plane, with the Ag (111) orientation present in all devices. Furthermore, the photo-response behavior under MIR exposure at λ = 4.2 µm was studied both experimentally and using COMSOL simulations. It was observed that both photoelectric (PE) and photothermal (PT) effects contributed to the photo-response behavior of all devices. The Ag/Si device exposed to air plasma for 300 s exhibited the maximum PE-driven response (2.73 µA/W), while the device exposed to air plasma for 600 s showed a significant PT-driven response (13.01 µA/W). In addition, this strategy helped reduce the reverse leakage current by up to 99.5%. This study demonstrates that MIR detection at longer wavelengths can be optimized by tailoring the crystal orientation of the metal film.

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The sputtering performance of Ag sputtering targets with different microstructure

Ning

Wang

et al. 2023

Vacuum

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Structural Evolution of Bulk Silver during Cold Rolling and Annealing

Cited by 3 publications

References 23 publications

Ag and Sn Implications in 3-Polker Coins Forgeries Evidenced by Nondestructive Methods

Ag and Sn Implications in 3-Polker Coins Forgeries Evidenced by Nondestructive Methods

Silicon (100) surface passivation-driven tuning of Ag film crystallinity and its impact on the performance of Ag/n-Si mid-infrared Schottky photodetector

The sputtering performance of Ag sputtering targets with different microstructure

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