Structural Properties of Co3Sn2, Ni3Sn2 and Some Ternary Derivatives.

Fjellvåg, Helmer; Kjekshus, Arne; Stomberg, Rolf; Zingales, R.; Vikholm, Inger; Urso, Fabio; Weidlein, Johann; Zingaro, Ralph A.

doi:10.3891/acta.chem.scand.40a-0023

Cited by 69 publications

(35 citation statements)

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“…X-ray powder di!raction data recorded from the specimens prepared from the homogenized rods (3 days at 473 K, 3 days at 1023 K, water quenching) indicate that the specimens consist of the disordered, hexagonal HT phase, as expected (6). After the specimens were annealed for 5 days at 673 K followed by water quenching, the X-ray powder diffraction patterns were recorded for all alloys indicated in Table 1 and show splitting of all fundamental re#ections except those with the indices 00l &2…”

Section: Occurrence Of the Ht And Lt Phasesmentioning

confidence: 86%

“…The occupational ordering scheme for the Ni(2) atoms in the LT phase is depicted in Fig. 1 (2) would not occur (6).…”

Section: Introductionmentioning

confidence: 99%

“…At relatively high temperatures (¹'+790 K, dependent on composition) a phase, here called HT phase, without long-range order of Ni (2) and exhibiting P6 /mmc symmetry (unit cell parameters a &2 , c &2 , number of formula units Z(Ni >V Sn)"2; Sn on 2c Wycko!-site: , , ; Ni(1) on 2a: 0,0,0; Ni(2) on 2d: , , with an occupancy of x), is stable (6,7). The HT phase can be retained easily by quenching.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

A NiAs/Ni2In-Type Phase Ni1+xSn (0.35<x<0.45) with Incommensurate Occupational Ordering of Ni

Leineweber

Ellner

Mittemeijer

2001

Journal of Solid State Chemistry

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Section: Occurrence Of the Ht And Lt Phasesmentioning

confidence: 86%

“…The occupational ordering scheme for the Ni(2) atoms in the LT phase is depicted in Fig. 1 (2) would not occur (6).…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

A NiAs/Ni2In-Type Phase Ni1+xSn (0.35<x<0.45) with Incommensurate Occupational Ordering of Ni

Leineweber

Ellner

Mittemeijer

2001

Journal of Solid State Chemistry

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“…An example of an EBSD pattern is shown in Figure 4C. The obtained Kikuchi patterns were compared with all reported equilibrium and metastable NixSny phases [31][32][33], including the oC20-NiSn4 phase proposed by Boettinger et al [24] and the tP10-NiSn4 phase proposed by Watanabe et al [34] and modelled by Ghosh [35]. Furthermore, since NiSn4 is not an established phase, the Kikuchi patterns of prototypes βIrSn4 [36] and PtPb4 [37] were also analysed for comparison.…”

Section: Identification Of the Nisn4 Phasementioning

confidence: 99%

The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints

Belyakov

Gourlay

2015

Journal of Elec Materi

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We explore the effect of dilute Cu additions on the suppression of metastable βSn-NiSn4 eutectic growth in solder joints between Sn-3.5Ag-xCu solders and Ni-based substrates.In Sn-3.5Ag/electroless nickel immersion gold (ENIG) or Sn-3.5Ag/Ni solder joints, it is shown that the eutectic mixture contains Sn, Ag3Sn and metastable NiSn4. It is found that additions of only 0.005wt%Cu to Sn-3.5Ag-xCu/ENIG or Sn-3.5Ag-xCu/Ni joints promote the formation of stable βSn-Ni3Sn4 eutectic and that both Ni3Sn4 and NiSn4 exist in the eutectic at this Cu level. It is further shown that for the full prevention of metastable NiSn4 during eutectic solidification of the solder joint, more considerable Cu additions of at least 0.3wt%Cu are required.Keywords: Microstructure, Pb-free soldering, Metastable, NiSn4, Intermetallics, Solidification INTRODUCTIONSn-Ag solders are a popular choice for consumer and power electronics [1] and the composition is frequently used on Ni-containing surface finishes, such as electroless nickel immersion gold (ENIG) and electroless nickel, electroless palladium immersion gold (ENEPIG), and on Ni-based UBMs (underbump metallizations). Solder reactions in the Sn/Ni and Sn-Ag/Ni systems and subsequent microstructure evolution have been widely studied [2][3][4][5][6][7][8][9][10][11][12][13][14][15] and most researchers reported Ni3Sn4 as the major interfacial reaction product in such systems, similar to that shown in Figure 1A. At the same time, it is known that non-equilibrium Sn-Ni intermetallics can form in Sn-Ni couples after soldering or during storage at elevated temperatures. In most cases non-equilibrium Sn-Ni compounds such as Ni3Sn8 [16], and NiSn4 [22][23][24] were found after solid state ageing or thermal cycling [16][17][18][19][21][22][23][24] or after heat treatments combined with electric current passage through the joint [19,22]. Figure 2A is an example of non-equilibrium NiSn4 formed at the interface during solid Figure 2B). In contrast, when soldered to Alloy42, the FeSn2 interfacial intermetallic layer serves as an efficient diffusion barrier limiting the amount of Ni that dissolves into the liquid solder during reflow [28,29].As result, this type of solder joints has less NiSn4 in the bulk solder than on Ni or ENIG substrates( Figure 2D). We have also found that trace Fe additions promote metastable NiSn4 formation due to epitaxial nucleation of NiSn4 on FeSn2 particles [30].We have recently demonstrated [27] that industrially important Sn-3.5Ag/ENIG or Sn-3.5Ag/Ni joints also solidify to contain metastable Sn-NiSn4 eutectic ( Figure 2A-C, E). Surprisingly, despite the fact that Sn-Ag solders have been used on Ni-containing substrates for decades, this phenomenon was missed in past research. NiSn4 is a metastable phase and can transform into equilibrium Ni3Sn4 and βSn whilst the solder joint is in service at elevated temperatures [25,27]. In automotive and power electronics, operation temperatures are relatively high (175-200°C) and microstructural stability and reliabil...

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“…• , indicated by arrows in figure 6, as belonging to the orthorhombic Ni 3 Sn 2 [9] compound which was subsequently included in the refinement. The refined parameters given in table 1 confirm the CeNiSi 2 type of structure [1] with a deviation of the Ni occupancy (0.84(1)) from the stoichiometric composition corresponding to the formula CeNi 0.84 Sn 2 .…”

Section: Nuclear Structurementioning

confidence: 99%

Magnetic properties of studied by magnetization and neutron diffraction

Schobinger‐Papamantellos¹,

Rodrı́guez-Carvajal²,

Prokeš³

et al. 1996

J. Phys.: Condens. Matter

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Abstract. The magnetic properties of the compound CeNiSn 2 were studied by magnetization measurements and neutron diffraction. The refinement of the nuclear structure shows that this compound is slightly Ni-deficient, the corresponding formula being CeNi 0.840(4) Sn 2 . At 1.5 K two coexisting magnetic phases were observed in equal amounts. One of these is ferromagnetic q 1 = 0 with T C = 3 K. The other phase is an antiferromagnetic modulated phase (antiphase domain type with two amplitudes) with T N = 4.0 K. Its magnetic ordering can be described in terms of two propagation vectors q 2 = (010) (C P magnetic lattice) and q 3 = 1 3 b * . The ordered magnetic moment value at 1.5 K in both phases is 2.0µ B per Ce atom and points in the same direction along c. Above 2 K the wavevector q 3 becomes incommensurate with the crystal lattice. The observation of two magnetic phases is attributed to the occurrence of concentration fluctuations associated with the Ni deficiency.

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Structural Properties of Co3Sn2, Ni3Sn2 and Some Ternary Derivatives.

Cited by 69 publications

References 0 publications

A NiAs/Ni2In-Type Phase Ni1+xSn (0.35<x<0.45) with Incommensurate Occupational Ordering of Ni

A NiAs/Ni2In-Type Phase Ni1+xSn (0.35<x<0.45) with Incommensurate Occupational Ordering of Ni

The Influence of Cu on Metastable NiSn4 in Sn-3.5Ag-xCu/ENIG Joints

Magnetic properties of studied by magnetization and neutron diffraction

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